Anisotropic conductive connector device and production method therefor and circuit device inspection device

ABSTRACT

An anisotropic conductive connector device including an anisotropic conductive film provided with a plurality of conducting path forming portions extended in a direction of a thickness in a state in which they are insulated from each other through an insulating portion, and a sheet-like connector in which an insulating sheet is provided with a plurality of electrode structures extended in a direction of a thickness thereof. The sheet-like connector is provided integrally on or is integrated with the anisotropic conductive film in a state in which each of the electrode structures is positioned on each of the conducting path forming portions of the anisotropic conductive film.

CROSS REFERENCE

This application is a national stage of PCT/JP04/17534, filed on Jun. 1,2004, and claims benefit under 35 U.S.C. § 119 from Japanese PatentApplication No. 2003-167818, filed on Jun. 12, 2003, and Japanese PatentApplication No. 2003-275407, filed on Jul. 16, 2003.

1. Technical Field

The present invention relates to an anisotropic conductive connectordevice which can be suitably used for inspecting a circuit device suchas a semiconductor integrated circuit and a method of manufacturing thesame, and an apparatus for inspecting a circuit device comprising theanisotropic conductive connector device.

2. Background Art

An anisotropic conductive sheet exhibit the conductivity in only thedirection of the thickness or has a pressurizing conducting portionexhibiting a conductivity in only a direction of a thickness when it ispressed in the direction of the thickness, and has a feature that acompact electrical connection can be achieved without using means suchas soldering or mechanical fitting and a mechanical shock or strain canbe absorbed to carry out a soft connection.

Therefore, by utilizing such a feature, for example, in the field of anelectronic computer, an electronic digital clock, an electronic camera,a computer keyboard or the like, the anisotropic conductive sheet hasbeen used widely as an anisotropic conductive connector for achieving anelectrical connection between circuit devices, for example, anelectrical connection of a printed circuit board to a leadless chipcarrier, a liquid crystal panel or the like.

Moreover, in an electrical inspection for a circuit device such as aprinted circuit board or a semiconductor integrated circuit, forexample, in order to achieve an electrical connection between anelectrode to be inspected, which is formed over one surface of thecircuit device, and an electrode for an inspection which is formed onthe surface of the circuit board for an inspection, the anisotropicconductive sheet is provided as a connector between an electrode regionof the circuit device to be an inspecting object and an electrode regionfor an inspection of a circuit board for an inspection.

Conventionally, there have been known anisotropic conductive sheetshaving various structures in which:

-   -   a metallic particle is dispersed uniformly in an elastomer (for        example, Patent Document 1 (see Japanese Laid-Open Patent        Publication No.1976-93393)),    -   a conductive magnetic metal is dispersed nonuniformly in the        elastomer so that a large number of conducting path forming        portions extended in a direction of a thickness and an        insulating portion for mutually insulating them are formed (for        example, Patent Document 2 (see Japanese Laid-Open Patent        Publication No.1978-147772)), and    -   a step is formed between the surface of the conducting path        forming portion and the insulating portion (for example, Patent        Document 3 (see Japanese Laid-Open Patent Publication        No.1986-250906)).

In these anisotropic conductive sheets, conductive particles arecontained in an insulating elastically polymeric substance in anarranging and orienting state in a direction of a thickness, and aconducting path is formed by a chain of a large number of conductiveparticles.

Such an anisotropic conductive sheet can be manufactured by injecting,into a molding space of a metal mold, a molding material obtained bycontaining a conductive particle having a magnetism in a polymericsubstance forming material to be an elastically polymeric substance bycuring, thereby forming a molding material layer and applying a magneticfield thereto to carry out a curing treatment, for example.

However, for example, in an electrical inspection for a circuit devicehaving a protruded electrode formed of a soldering alloy, in the case inwhich an anisotropic conductive sheet according to the conventional artis to be used as a connector, there is the following problem.

More specifically, by the repetition of an operation for causing theprotruded electrode which is an electrode to be inspected in a circuitdevice to be an inspecting object to come in pressure contact with thesurface of the anisotropic conductive sheet, a permanent deformation iscaused by the pressure contact of the protruded electrode or adeformation is caused by an abrasion over the surface of the anisotropicconductive sheet. Therefore, the electric resistance value of theconducting path forming portion in the anisotropic conductive sheet isincreased and the electric resistance value of each conducting pathforming portion is varied. For this reason, there is a problem in thatit is hard to inspect succeeding circuit devices.

Moreover, as for a conductive particle for constituting the conductingpath forming portion, in order to obtain a high conductivity, the aconductive particle which is formed by a coating layer made of gold isusually used. By continuously carrying out the electrical inspection ofa large number of circuit devices, however, an electrode substance (asoldering alloy) constituting the electrode to be inspected in thecircuit device is moved to the coating layer of the conductive particlein the anisotropic conductive sheet. For this reason, the coating layeris altered. As a result, there is a problem in that the conductivity ofthe conducting path forming portion is reduced.

Moreover, for example, in the electrical inspection for a circuit devicehaving a pad electrode formed of aluminum, in the case in which theanisotropic conductive sheet according to the conventional art is usedas a connector, there is the following problem.

More specifically, in the circuit device having the pad electrode, aresist film having a greater thickness than that of the pad electrode isusually formed on the surface of the circuit device. In order toreliably carry out an electrical connection to the pad electrode of thecircuit device having the resist film formed thereon, there is used ananisotropic conductive sheet in which a conducting path forming portionprotruded from the surface of an insulating portion is provided.

By repetitively using such an anisotropic conductive sheet, however, apermanent compressive deformation is generated over the conducting pathforming portion. Therefore, the electric resistance value of theconducting path forming portion in the anisotropic conductive sheet isincreased or the stable electrical connection of the conducting pathforming portion for the pad electrode is not achieved. As a result, theelectric resistance value between the pad electrode which is theelectrode to be inspected and the electrode for an inspection in thecircuit board for an inspection is varied. Consequently, there is aproblem in that it is hard to inspect succeeding circuit devices.

In order to solve these problems, in the inspection of the circuitdevice, the connector device is constituted by the anisotropicconductive sheet and a sheet-like connector in which a plurality ofelectrode structures penetrating and extended in a direction of athickness is arranged in a soft insulating sheet formed of a resinmaterial. In addition, the electrode to be inspected is pressed incontact with the electrode structure of the sheet-like connector in theconnector device, so that an electrical connection with the circuitdevice to be the inspecting object can be achieved (for example, seePatent Document 4 (Japanese Laid-Open Patent Publication No.1995-231019), Patent Document 5 (Japanese Laid-Open Patent PublicationNo. 2000-324601), Patent Document 6 (Korean Laid-Open Patent PublicationNo. 2002-24419), and Patent Document 7 (Korean Registered Utility ModelPublication No. 20-278989)).

However, in the connector devices described in the Patent Document 4(Japanese Laid-Open Patent Publication No. 1995-231019), the PatentDocument 5 (Japanese Laid-Open Patent Publication No. 2000-324601), thePatent Document 6 (Korean Laid-Open Patent Publication No. 2002-24419),and the Patent Document 7 (Korean Registered Utility Model PublicationNo. 20-278989), in the case in which the pitch of the electrode to beinspected in the circuit device to be the inspecting object is small,that is, the pitches of the electrode structure of the sheet-likeconnector and the conducting path forming portion of the anisotropicconductive sheet are small, there is the following problem.

More specifically, the alignment of the anisotropic conductive sheetwith the sheet-like connector is carried out by forming a positioninghole in respective peripheral edge portions or fixing the respectiveperipheral edge portions to frame-shaped supporting bodies having thepositioning holes and inserting a common guide pin through therespective positioning holes.

However, in such means, when the pitches of the electrode structure ofthe sheet-like connector and the conducting path forming portion of theanisotropic conductive sheet are reduced, it is harder to reliably alignboth of them.

Moreover, also in the case in which a desirable alignment is onceimplemented, the positional shift of the conducting path forming portionand the electrode structure is generated when the connector device isused. In the case in which the connector device is used in a test in ahigh temperature environment, for example, a burn-in test, thepositional shift is generated between the electrode structure of thesheet-like connector and the conducting path forming portion of theanisotropic conductive sheet due to a difference in a thermal expansionbetween a material for forming the anisotropic conductive sheet and amaterial for forming an insulating sheet of the sheet-like connector. Asa result, there is a problem in that an excellent electrical connectionstate cannot be maintained stably.

For this reason, there has been proposed a connector device in which asheet-like connector is provided integrally on an anisotropic conductivesheet (see Patent Document 8 (Japanese Laid-Open Patent Publication No.1999-258268) and Patent Document 9 (Korean Patent Publication No.2002-79350(International Laid-Open Patent Publication WO02/084730))).

However, in the connector device described in the Patent Document 8(Japanese Laid-Open Patent Publication No. 1999-258268), the PatentDocument 9 (Korean Laid-Open Patent Publication No. 2002-79350)(International Laid-Open Patent Publication WO02/084730)), thesheet-like connector and the anisotropic conductive sheet are simplyprovided integrally. Therefore, a bonding power between the sheet-likeconnector and the anisotropic conductive sheet is comparatively small.For this reason, in the case in which the inspection is carried outrepetitively, peeling is easily caused on an interface between thesheet-like connector and the anisotropic conductive sheet and there iscaused a conducting failure between the electrode structure of thesheet-like connector and the conducting path forming portion of theanisotropic conductive sheet, and use cannot be carried out and there isa problem in respect of a durability.

Patent Document 1: Japanese Laid-Open Patent Publication No. 1976-93393

Patent Document 2: Japanese Laid-Open Patent Publication No. 1978-147772

Patent Document 3: Japanese Laid-Open Patent Publication No. 1986-250906

Patent Document 4: Japanese Laid-Open Patent Publication No. 1995-231019

Patent Document 5: Japanese Laid-Open Patent Publication No. 2000-324601

Patent Document 6: Korean Laid-Open Patent Publication No. 2002-24419

Patent Document 7: Korean Registered Utility Model Publication No.20-278989

Patent Document 8: Japanese Laid -Open Patent Publication No.1999-258268

Patent Document 9: Korean Laid-Open Patent Publication No. 2002-79350

DISCLOSURE OF THE INVENTION

Problems to be Solved

The present invention has been made based on the above actualcircumstances and has an object to provide an anisotropic conductiveconnector device in which a work for aligning a sheet-like connector isnot required and an excellent electrical connection state can beobtained even if the pitch of an electrode to be a connecting object issmall, and furthermore, the excellent electrical connection state can bemaintained stably also in the case of repetitive use for a long periodof time or the case of use in a high temperature environment.

Moreover, it is an object of the present invention to provide a methodcapable of advantageously manufacturing the anisotropic conductiveconnector device.

Furthermore, it is an object of the present invention to provide anapparatus for inspecting a circuit device in which an excellentelectrical connection state can be obtained even if the pitch of anelectrode to be inspected in a circuit device to be an inspecting objectis small, and furthermore, the excellent electrical connection state canbe maintained stably also in the case of repetitive use for a longperiod of time or the case of use in a high temperature environment.

In addition, it is an object of the present invention to provide amethod of producing an anisotropic conductive connector having thesefeatures efficiently and inexpensively.

Means for Solving the Problems

The present invention has been made in order to achieve the problems andobjects in the prior art described above and provides an anisotropicconductive connector device comprising:

an anisotropic conductive film provided with a plurality of conductingpath forming portions extended in a direction of a thickness in a statein which they are insulated from each other through an insulatingportion; and

a sheet-like connector in which an insulating sheet is provided with aplurality of electrode structures extended in a direction of a thicknessthereof,

wherein the sheet-like connector is provided integrally on theanisotropic conductive film in a state in which each of the electrodestructures is positioned on each of the conducting path forming portionsof the anisotropic conductive film.

In this case, in this specification, “provided integrally” implies thatthe sheet-like connector is provided on the anisotropic conductive filmso as not to be mutually movable to positions in an integral bondingstate.

Thus, the sheet-like connector is provided integrally on the anisotropicconductive film in a state in which each of the electrode structures ispositioned on each of the conducting path forming portions of theanisotropic conductive film. Therefore, a work for aligning thesheet-like connector is not required, and an excellent electricalconnection state can be obtained even if the pitch of the electrode tobe a connecting object is small.

In addition, the sheet-like connector is provided integrally on theanisotropic conductive film. Also in the case of repetitive use for along period of time or the case of use in a high temperatureenvironment, therefore, it is possible to stably maintain an excellentelectrical connection state without generating a positional shiftbetween the conducting path forming portion of the anisotropicconductive film and the electrode structure of the sheet-like connector.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that the sheet-like connector isprovided with a through hole penetrating through both sides of theinsulating sheet and the electrode structure is provided in the throughhole.

Thus, the electrode structure is provided in the through holepenetrating through both sides of the insulating sheet. Therefore, it ispossible to stably maintain an excellent electrical connection statewithout shifting the position of the electrode structure of thesheet-like connector.

Furthermore, the anisotropic conductive connector device according tothe present invention is characterized in that the electrode structureof the sheet-like connector includes:

a surface electrode portion exposed from a surface of the insulatingsheet;

a back electrode portion exposed from a back face of the insulatingsheet; and

a short circuit portion extended in a direction of a thickness of theinsulating sheet,

wherein the surface electrode portion and the back electrode portion arecoupled integrally through the coupling portion.

By such a structure, it is possible to reliably form a conducting pathfrom the surface electrode portion exposed from the surface of theinsulating sheet to the back electrode portion exposed from the backface of the insulating sheet through the short circuit portion.Consequently, it is possible to stably maintain an excellent electricalconnection state.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that a through hole for couplingis formed on the insulating sheet of the sheet-like connector,

the insulating portion of the anisotropic conductive film is providedwith a protruded portion for coupling which is protruded from a surfacethereof, and

the protruded portion for coupling in the anisotropic conductive film isinserted in the through hole for coupling in the sheet-like connector.

By such a structure, the protruded portion for coupling which is formedon the anisotropic conductive film is inserted in the through hole forcoupling which is formed on the insulating sheet of the sheet-likeconnector. Consequently, the sheet-like connector is brought into astate in which it cannot be mutually moved to positions over theanisotropic conductive film.

As a result, the generation of the positional shift between theconducting path forming portion of the anisotropic conductive film andthe electrode structure of the sheet-like connector can be preventedmore reliably.

Furthermore, the present invention provides an anisotropic conductiveconnector device comprising:

an anisotropic conductive film provided with a plurality of conductingpath forming portions extended in a direction of a thickness in a statein which they are insulated from each other through an insulatingportion; and

a sheet-like connector in which an insulating sheet is provided with aplurality of electrode structures extended in a direction of a thicknessthereof,

wherein the sheet-like connector is integrated on the anisotropicconductive film in a state in which each of the electrode structures ispositioned on each of the conducting path forming portions of theanisotropic conductive film.

In this case, in this specification, “integrated” implies that thesheet-like connector is integrated with the anisotropic conductive filmover the anisotropic conductive film so as not to be mutually movable topositions.

Thus, the sheet-like connector is integrated with the anisotropicconductive film over the anisotropic conductive sheet in a state inwhich each of the electrode structures is positioned on each of theconducting path forming portions of the anisotropic conductive film.Therefore, a work for aligning the sheet-like connector is not requiredand an excellent electrical connection state can be obtained even if thepitch of the electrode to be the connecting object is small.

In addition, the sheet-like connector is integrated with the anisotropicconductive film over the anisotropic conductive film. Also in the caseof repetitive use for a long period of time or the case of use in a hightemperature environment, therefore, it is possible to stably maintain anexcellent electrical connection state without generating a positionalshift between the conducting path forming portion of the anisotropicconductive film and the electrode structure of the sheet-like connector.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that the sheet-like connector isprovided with a void communicating with both sides of the insulatingsheet and the electrode structure is provided in the void.

Thus, the electrode structure is provided in the void communicating withboth sides of the insulating sheet. Therefore, it is possible to stablymaintain an excellent electrical connection state without shifting theposition of the electrode structure of the sheet-like connector.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that the insulating sheet of thesheet-like connector is formed by a mesh, a nonwoven fabric or a poroussheet.

If the insulating sheet of the sheet-like connector is formed by themesh, the nonwoven fabric or the porous sheet, thus, the electrodestructure can be provided in the void communicating with both sides.Furthermore, the material constituting the anisotropic conductive filmor an adhesive for causing the anisotropic conductive film and thesheet-like connector to adhere to each other is cured in the other voidsin a permeation state between the voids. Consequently, the sheet-likeconnector can be integrated with the anisotropic conductive connectorreliably and firmly.

Accordingly, it is possible to stably maintain a more excellentelectrical connection state without shifting the position of theelectrode structure of the sheet-like connector.

In addition, according to the anisotropic conductive connector device,the insulating sheet of the sheet-like connector is formed by the mesh,the non-woven fabric or the porous sheet. Therefore, a work for forminga through hole is not required in the manufacture of the sheet-likeconnector, and the sheet-like connector can be manufactured efficientlyand inexpensively and the anisotropic conductive connector device canalso be manufactured efficiently and inexpensively.

Furthermore, according to the anisotropic conductive connector device,the insulating sheet of the sheet-like connector is formed by the mesh,the nonwoven fabric or the porous sheet. Therefore, when the sheet-likeconnector is to be integrated with the anisotropic conductive film ofthe anisotropic conductive connector, the sheet-like connector isprovided on a molding material layer in a metal mold and the moldingmaterial layer is subjected to a curing treatment. Consequently, theelastically polymeric substance constituting the molding material layeris cured in a permeation state into the mesh, the nonwoven fabric or theporous sheet. Therefore, it is possible to integrate the sheet-likeconnector with the anisotropic conductive film reliably and firmly.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that the anisotropic conductivefilm is formed by an insulating elastically polymeric substance, and

the conducting path forming portion contains a conductive particleexhibiting a magnetism.

By such a structure, a pressurization and a deformation can easily becarried out. In addition, in the conducting path forming portion, theconductive particle exhibiting the magnetism is easily brought into anorientation state by the application of a magnetic field. As a result, asufficient electrical contact can be obtained between the conductiveparticles in the conducting path forming portion.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that a supporting body forsupporting a peripheral edge portion of the anisotropic conductive filmis provided.

By such a structure, the anisotropic conductive connector device canaccurately be fixed onto the surface of the circuit board for aninspection in a state in which a guide pin is inserted in a positioninghole formed on the supporting body and the conducting path formingportion of the anisotropic conductive film is thus positioned to beplaced on the electrode for an inspection in the circuit board for aninspection.

Furthermore, the anisotropic conductive connector device according tothe present invention is characterized in that the anisotropicconductive connector device is provided between a circuit device to bean inspecting object and a circuit board for an inspection and serves tocarry out an electrical connection of an electrode to be inspected inthe circuit device and an inspecting electrode of the circuit board, and

the sheet-like connector is disposed on one surface side placed incontact with the circuit device to be the inspecting object.

By such a structure, the anisotropic conductive connector device isfixed onto the surface of the circuit board for an inspection in a statein which the conducting path forming portion of the anisotropicconductive film is positioned to be placed on the electrode for aninspection in the circuit board for an inspection. The electrode to beinspected in the circuit board to be the inspecting object can be thuspressed in abutment on the electrode structure of the sheet-likeconnector.

Consequently, each of the effective conducting path forming portions ofthe anisotropic conductive connector device is brought into a pressureinterposing state by the electrode structure of the sheet-like connectorand the electrode for an inspection in the circuit board for aninspection.

As a result, an electrical connection can be achieved between eachelectrode to be inspected in the circuit device to be the inspectingobject and each electrode for an inspection in the circuit board for aninspection. Consequently, the inspection for the circuit device can beexecuted rapidly and accurately.

In addition, the anisotropic conductive connector device according tothe present invention is characterized in that, the anisotropicconductive film is provided with the conducting path forming portionswhich are not electrically connected to the electrode to be inspected,in addition to the conducting path forming portions which iselectrically connected to the electrode to be inspected in the circuitdevice to be the inspecting object.

By such a structure, it is possible to dispose the conducting pathforming portion in accordance with a pattern corresponding to thepattern of the electrode to be the connecting object, for example, theelectrode to be inspected in the circuit device to be the inspectingobject, thereby maintaining an electrical connection reliably.

Moreover, the anisotropic conductive connector device according to thepresent invention is characterized in that the conducting path formingportions are disposed at a constant pitch.

By such a structure, even if the pitch of the electrode to be theconnecting object, for example, the electrode to be inspected in thecircuit device to be the inspecting object is small, it is possible toobtain an excellent electrical connection state.

Furthermore, the present invention provides a method of manufacturingthe anisotropic conductive connector device described above, comprisingthe steps of:

preparing a metal mold for molding an anisotropic conductive film inwhich a molding space is formed by a pair of molds;

forming a molding material layer constituted by a molding material foran anisotropic conductive film, in which a conductive particleexhibiting a magnetism is contained in a liquid polymeric substanceforming material to be an elastically polymeric substance by curing, inthe metal mold, and disposing the sheet-like connector on the moldingmaterial layer; and

then applying a magnetic field having an intensity distribution in adirection of a thickness of the molding material layer and carrying outa curing treatment over the molding material layer,

the anisotropic conductive connector device having the sheet-likeconnector provided integrally on the anisotropic conductive film beingthus obtained.

By such a structure, the anisotropic conductive connector device havingthe sheet-like connector provided integrally on the anisotropicconductive film can be manufactured advantageously and reliably.

In addition, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized byuse, as the insulating sheet, of a sheet-like connector provided with athrough hole penetrating through both sides of the insulating sheet,

a molding material layer is formed in order to fill the through hole ofthe insulating sheet with a molding material for an anisotropicconductive film.

By such a structure, the molding material for the anisotropic conductivefilm is filled in the through hole of the insulating sheet and is thuscured. Consequently, the sheet-like connector is provided on theanisotropic conductive film so as not to be mutually movable topositions and the anisotropic conductive connector device providedintegrally on the anisotropic conductive film can be obtained easily,readily and reliably.

Accordingly, in the anisotropic conductive connector device thusobtained, the sheet-like connector is provided integrally on theanisotropic conductive film in a state in which each of the electrodestructures is positioned on each of the conducting path forming portionsof the anisotropic conductive film. Therefore, a work for aligning thesheet-like connector is not required, and an excellent electricalconnection state can be obtained even if the pitch of the electrode tobe the connecting object is small.

In addition, the sheet-like connector is provided integrally on theanisotropic conductive film. Therefore, also in the case of repetitiveuse for a long period of time or the case of use in a high temperatureenvironment, a positional shift is not generated between the conductingpath forming portion of the anisotropic conductive film and theelectrode structure of the sheet-like connector. Thus, it is possible tostably maintain an excellent electrical connection state.

Moreover, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized byuse, as the insulating sheet, of the sheet-like connector having athrough hole for coupling formed on the insulating sheet,

a molding material layer is formed in order to fill the through hole forcoupling in the sheet-like connector with a molding material for ananisotropic conductive film.

By such a structure, the molding material for an anisotropic conductivefilm which is filled in the through hole for coupling is cured andbecomes a protruded portion for coupling which is formed on theanisotropic conductive film to bring an insertion state in the throughhole for coupling which is formed on the insulating sheet of thesheet-like connector. Consequently, the sheet-like connector is set tobe mutually non-movable to positions over the anisotropic conductivefilm.

Consequently, the generation of the positional shift between theconducting path forming portion of the anisotropic conductive film andthe electrode structure of the sheet-like connector can be preventedstill more reliably.

Furthermore, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized bythe sheet-like connector forming steps of:

forming a through hole penetrating through both sides of the insulatingsheet on the insulating sheet in accordance with a pattern correspondingto a pattern of an electrode structure to be formed by a laserprocessing method or a dry etching method, and

filling the pattern hole with an electrode structure material by aplating method, thereby forming the sheet-like connector in which theinsulating sheet is provided with a plurality of electrode structuresextended in a direction of a thickness thereof.

By such a structure, the through hole penetrating through both sides ofthe insulating sheet can be formed easily and accurately in accordancewith the pattern corresponding to the pattern of the electrode structureto be formed by the laser processing method or the dry etching method.

In addition, the through hole is filled with the electrode structurematerial by a plating method. Consequently, it is possible to easily andaccurately form, on the insulating sheet, the sheet-like connectorprovided with a plurality of electrode structures extended in adirection of a thickness thereof.

Consequently, the anisotropic conductive connector device having thesheet-like connector provided integrally on the anisotropic conductivefilm can be manufactured advantageously and reliably.

Moreover, the present invention provides a method of manufacturing theanisotropic conductive connector device described above, comprising thesteps of:

preparing a metal mold for molding an anisotropic conductive film inwhich a molding space is formed by a pair of molds;

forming a molding material layer constituted by a molding material foran anisotropic conductive film, in which a conductive particleexhibiting a magnetism in a liquid polymeric substance forming materialto be an elastically polymeric substance by curing, in the metal mold,and disposing the sheet-like connector on the molding material layer;and

then applying a magnetic field having an intensity distribution in adirection of a thickness of the molding material layer and carrying outa curing treatment over the molding material layer,

the anisotropic conductive connector device having the sheet-likeconnector integrated on the anisotropic conductive film being thusobtained.

By such a structure, the anisotropic conductive connector device havingthe sheet-like connector provided integrally on the anisotropicconductive film can be manufactured advantageously and reliably.

Furthermore, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized byuse, as the insulating sheet, of a sheet provided with a voidcommunicating with both sides of the insulating sheet,

a molding material layer is formed in order to fill the void of theinsulating sheet with a molding material for an anisotropic conductivefilm.

By such a structure, the molding material for an anisotropic conductivefilm is filled in the void communicating with both sides of theinsulating sheet and is thus cured. Consequently, it is possible toeasily and reliably obtain the anisotropic conductive connector devicein which the sheet-like connector is integrated with the anisotropicconductive film over the anisotropic conductive film so as not to bemutually movable to positions.

Accordingly, in the anisotropic conductive connector device thusobtained, the sheet-like connector is integrated with the anisotropicconductive film over the anisotropic conductive film in a state in whicheach of the electrode structures is positioned on each of the conductingpath forming portions of the anisotropic conductive film. Therefore, awork for aligning the sheet-like connector is not required, and anexcellent electrical connection state can be obtained even if the pitchof the electrode to be the connecting object is small.

In addition, the sheet-like connector is integrated with the anisotropicconductive film over the anisotropic conductive film. Therefore, also inthe case of repetitive use for a long period of time or the case of usein a high temperature environment, a positional shift is not generatedbetween the conducting path forming portion of the anisotropicconductive film and the electrode structure of the sheet-like connector.Thus, it is possible to stably maintain an excellent electricalconnection state.

In addition, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized inthat the insulating sheet of the sheet-like connector is formed by amesh, a nonwoven fabric or a porous sheet.

If the insulating sheet of the sheet-like connector is formed by themesh, the nonwoven fabric or the porous sheet, thus, the electrodestructure can be provided in the void communicating with both sides.Furthermore, the material constituting the anisotropic conductive filmor an adhesive for causing the anisotropic conductive film and thesheet-like connector to adhere to each other is cured in the other voidsin a permeation state between the voids. As a result, the sheet-likeconnector can be integrated with the anisotropic conductive connectorreliably and firmly.

Accordingly, it is possible to stably maintain a more excellentelectrical connection state without shifting the position of theelectrode structure of the sheet-like connector.

Moreover, according to the anisotropic conductive connector device, theinsulating sheet of the sheet-like connector is formed by the mesh, thenon-woven fabric or the porous sheet. Therefore, a work for forming athrough hole is not required in the manufacture of the sheet-likeconnector, and the sheet-like connector can be manufactured efficientlyand inexpensively and the anisotropic conductive connector device canalso be manufactured efficiently and inexpensively.

Furthermore, according to the anisotropic conductive connector device,the insulating sheet of the sheet-like connector is formed by the mesh,the nonwoven fabric or the porous sheet. Therefore, when the sheet-likeconnector is to be integrated with the anisotropic conductive film ofthe anisotropic conductive connector, the sheet-like connector isprovided on the molding material layer in the metal mold and the moldingmaterial layer is subjected to a curing treatment. Consequently, theelastically polymeric substance constituting the molding material layeris cured in a permeation state into the mesh, the nonwoven fabric or theporous sheet. Therefore, it is possible to integrate the sheet-likeconnector with the anisotropic conductive film reliably and firmly.

Moreover, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized bythe sheet-like connector forming steps of:

applying a resist to both sides of the insulating sheet to form a resistlayer;

peeling the resist layer in accordance with a pattern corresponding to apattern of an electrode structure to be formed, thereby forming aplurality of pattern holes on the resist layer; and

filling the pattern hole with an electrode structure material and thenpeeling the resist layer, thereby forming the sheet-like connector inwhich the insulating sheet is provided with a plurality of electrodestructures extended in a direction of a thickness thereof.

By such a structure, it is possible to easily and reliably manufacture asheet-like connector in which the insulating sheet is provided with aplurality of electrode structures extended in a direction of a thicknessthereof in accordance with the pattern corresponding to the pattern ofthe electrode structure to be formed. As a result, it is possible toadvantageously and reliably obtain the anisotropic conductive connectordevice in which the sheet-like connector is integrated on theanisotropic conductive film.

Furthermore, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized inthat a protective film is disposed between a molding surface of one ofmolds in the metal mold and the sheet-like connector.

The protective film is disposed between the molding surface of one ofthe molds in the metal mold and the sheet-like connector. Consequently,it is possible to prevent the molding surface of the metal mold and theelectrode structure of the sheet-like connector from being damaged andto hinder the molding material from entering the surface of thesheet-like connector, that is, the surface on the metal mold side.

Consequently, the molding material to be the insulating substance cannot be stuck to the surface of the electrode structure of the sheet-likeconnector, thereby preventing an electrical connecting failure and anelectrical connection can be maintained reliably. Thus, it is possibleto provide an anisotropic conductive connector device capable ofexecuting an accurate inspection.

In addition, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized inthat a supporting body protruded from a molding space is disposedbetween the pair of metal molds and the molding material layer issubjected to a curing treatment so that an anisotropic conductiveconnector device provided with a supporting body for supporting aperipheral edge portion of the anisotropic conductive film is obtained.

Thus, the supporting body protruded from the molding space is disposedbetween the metal molds to carry out a curing treatment over the moldingmaterial layer. Consequently, it is possible to obtain the anisotropicconductive connector device in which the supporting body for supportingthe peripheral edge portion of the anisotropic conductive film is fixedby the molding material layer.

According to the anisotropic conductive connector device thusmanufactured, a guide pin is inserted in a positioning hole formed onthe supporting body. Consequently, it is possible to accurately fix theanisotropic conductive connector device onto the surface of the circuitboard for an inspection in a state in which the conducting path formingportion of the anisotropic conductive film is positioned to be placed onthe electrode for an inspection in the circuit board for an inspection.

Moreover, the method of manufacturing an anisotropic conductiveconnector device according to the present invention is characterized inthat;

a spacer is provided between the pair of metal molds and the supportingbody to form the molding space and

the molding material layer is subjected to curing treatment so that ananisotropic conductive connector device, which is provided with thesupporting body for supporting a peripheral edge portion of theanisotropic conductive film, is obtained.

Thus, the spacer is provided between the pair of metal molds and thesupporting body to form the molding space, and the molding materiallayer is subjected to the curing treatment. Consequently, it is possibleto obtain an anisotropic conductive connector device in which thesupporting body for supporting the peripheral edge portion of theanisotropic conductive film is fixed by the molding material layer morefirmly.

Furthermore, the present invention provides an apparatus for inspectinga circuit device comprising:

a circuit board for an inspection which has an electrode for aninspection disposed corresponding to an electrode to be inspected in acircuit device to be an inspecting object; and

the anisotropic conductive connector device described above which isdisposed on the circuit board for an inspection.

Consequently, even if the electrode to be inspected in the circuitdevice to be the inspecting object has a small pitch, it is possible toprovide the apparatus for inspecting a circuit device in which anexcellent electrical connection state can be obtained. Furthermore, alsoin the case of repetitive use for a long period of time or the case ofuse in a high temperature environment, the excellent electricalconnection state can be maintained stably.

Effect of the Invention

According to the anisotropic conductive connector device in accordancewith the present invention, the sheet-like connector is providedintegrally on the anisotropic conductive film or is integratedtherewith. Therefore, a work for aligning the sheet-like connector isnot required, and even if the pitch of the electrodes to be theconnecting object is small, an excellent electrical connection state canbe obtained.

In addition, also in the case of repetitive use for a long period oftime or the case of use in a high temperature environment, a positionalshift between the conducting path forming portion and the electrodestructure is not generated. Accordingly, it is possible to stablymaintain the excellent electrical connection state.

Moreover, according to the anisotropic conductive connector device inaccordance with the present invention, the sheet-like connector isobtained by an insulating sheet formed by the mesh, the nonwoven fabricor the porous sheet on which a void communicating with both sides of theinsulating sheet is provided. Therefore, a work for forming a throughhole is not required in the manufacture of the sheet-like connector.Consequently, the sheet-like connector can be manufactured efficientlyand inexpensively. Thus, the anisotropic conductive connector device canalso be manufactured efficiently and inexpensively.

Furthermore, according to the anisotropic conductive connector device inaccordance with the present invention, the sheet-like connector isobtained by the insulating sheet formed by the mesh, the nonwoven fabricor the porous sheet. Therefore, When the sheet-like connector is to beintegrated with the anisotropic conductive film of the anisotropicconductive connector, the sheet-like connector is disposed on themolding material layer in the metal mold to carry out the curingtreatment over the molding material layer. Consequently, an elasticallypolymeric substance constituting the molding material layer is cured ina permeation state into the mesh or the nonwoven fabric. Thus, it ispossible to integrate the sheet-like connector with the anisotropicconductive connector reliably and firmly.

In the anisotropic conductive connector device in which the sheet-likeconnector is integrated, thus, also in the case of repetitive use for along period of time or the case of use in a high temperatureenvironment, a positional shift between the conducting path formingportion and the electrode structure is not generated. Accordingly, it ispossible to stably maintain an excellent electrical connection state.

Furthermore, according to the method of manufacturing an anisotropicconductive connector device in accordance with the present invention,the sheet-like connector is disposed on the molding material layer forobtaining the anisotropic conductive film and the molding material layeris subjected to a curing treatment in this state. Therefore, it ispossible to advantageously and reliably manufacture the anisotropicconductive connector device in which the sheet-like connector isprovided integrally on the anisotropic conductive film.

Moreover, according to the apparatus for inspecting the circuit devicein accordance with the present invention, the anisotropic conductiveconnector is provided. Therefore, also in the case of repetitive use fora long period of time or the case of use in a high temperatureenvironment, the positional shift between the conducting path formingportion and the electrode structure is not generated. Accordingly, it ispossible to stably maintain an excellent electrical connection state.

Furthermore, according to the apparatus for inspecting the circuitdevice in accordance with the present invention, the sheet-likeconnector formed by the insulating sheet constituted by the mesh, thenonwoven fabric or the porous sheet is present between the anisotropicconductive film of the anisotropic conductive connector and theelectrode to be inspected in the substance to be inspected. Therefore,it is possible to reliably suppress a damage in the inspection for thesubstance to be inspected due to the removal of a conductive particlefrom the anisotropic conductive film.

In addition, the sheet-like connector is manufactured by using theinsulating sheet formed by the mesh, the nonwoven fabric or the poroussheet. Therefore, the through hole of the insulating sheet is notutilized. Consequently, it is possible to easily obtain the electrodestructure of the sheet-like connector thus obtained in which the surfaceof an electrode is flat and the through hole is not present.

Therefore, according to the apparatus for inspecting a circuit devicehaving the structure described above which comprises the sheet-likeconnector having the electrode structure in which the surface of theelectrode is flat and the through hole is not present, also in the casein which the electrode to be inspected in the substance to be inspectedis a soldering protruded electrode having a small hardness, thesoldering protruded electrode of the substance to be inspected can beprevented from being damaged due to the pressure contact of theelectrode structure of the sheet-like connector with the through holeportion in the inspection.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing an anisotropic conductive connectordevice.

FIG. 2 is an explanatory view showing an X-X section in the anisotropicconductive connector device illustrated in FIG. 1.

FIG. 3 is an enlarged explanatory view showing a part of a Y-Y sectionin the anisotropic conductive connector device illustrated in FIG. 1.

FIG. 4 is a plan view showing a supporting body in the anisotropicconductive connector device illustrated in FIG. 1.

FIG. 5 is an X-X sectional view showing the supporting body illustratedin FIG. 4.

FIG. 6 is an explanatory sectional view showing a structure according toan example of a metal mold for molding an anisotropic conductive film.

FIG. 7 is an explanatory sectional view showing the structure of alaminating material for obtaining a sheet-like connector.

FIG. 8 is an explanatory sectional view showing a state in which athrough hole is formed on an insulating sheet in the laminatingmaterial.

FIG. 9 is an explanatory sectional view showing a state in which a shortcircuit portion and a surface electrode portion are formed on aninsulating sheet.

FIG. 10 is an explanatory sectional view showing a state in which a backelectrode portion is formed on the back face of the insulating sheet.

FIG. 11 is an explanatory sectional view showing a state in which athrough hole for coupling is formed on the insulating sheet.

FIG. 12 is an explanatory sectional view showing a state in which aspacer and a supporting body are disposed on the molding surface of alower mold.

FIG. 13 is an explanatory sectional view showing a state in which asheet-like connector is disposed on the molding surface of an upper moldthrough a protective film.

FIG. 14 is an explanatory sectional view showing a state in which amolding material layer is formed in an upper mold and each of metalmolds.

FIG. 15 is an explanatory sectional view showing a state in which amolding material layer having an intended configuration is formed in themetal mold.

FIG. 16 is an explanatory sectional view partially showing the enlargedmolding material layer.

FIG. 17 is an explanatory sectional view showing a state in which amagnetic field acts on the molding material layer.

FIG. 18 is a plan view showing an anisotropic conductive connectordevice according to a second example of the present invention.

FIG. 19 is an explanatory view showing an X-X section of the anisotropicconductive connector device illustrated in FIG. 18.

FIG. 20 is an explanatory view partially showing an enlarged Y-Y sectionof the anisotropic conductive connector device illustrated in FIG. 18.

FIG. 21 is an explanatory sectional view showing the structure of alaminating material for obtaining a sheet-like connector.

FIG. 22 is an explanatory sectional view showing a state in which athrough hole is formed on the laminating material.

FIG. 23 is an explanatory sectional view showing a state in which ashort circuit portion is formed on an insulating sheet.

FIG. 24 is an explanatory sectional view showing a state in which asurface electrode portion and a back electrode portion are formed on thesurface and back face of the insulating sheet.

FIG. 25 is an explanatory sectional view showing a state in which athrough hole for coupling is formed on the insulating sheet.

FIG. 26 is a plan view showing an anisotropic conductive connectordevice according to a third example of the present invention.

FIG. 27 is an explanatory view showing an X-X section of the anisotropicconductive connector device illustrated in FIG. 26.

FIG. 28 is an explanatory view partially showing an enlarged Y-Y sectionof the anisotropic conductive connector device illustrated in FIG. 26.

FIG. 29 is an explanatory sectional view showing the structure of alaminating material for obtaining a sheet-like connector.

FIG. 30 is an explanatory sectional view showing a state in which athrough hole is formed on an insulating sheet in the laminatingmaterial.

FIG. 31 is an explanatory sectional view showing a state in which ashort circuit portion and a surface electrode portion are formed on theinsulating sheet.

FIG. 32 is an explanatory sectional view showing a state in which a backelectrode portion is formed on the back face of the insulating sheet.

FIG. 33 is an explanatory sectional view showing a state in which athrough hole for coupling is formed on the insulating sheet.

FIG. 34 is an explanatory sectional view showing a state in which aspacer and a supporting body are disposed on the molding surface of alower mold.

FIG. 35 is an explanatory sectional view showing a state in which asheet-like connector is disposed on the molding surface of an upper moldthrough a protective film.

FIG. 36 is an explanatory sectional view showing a state in which amolding material layer is formed in an upper mold and each of metalmolds.

FIG. 37 is an explanatory sectional view showing a state in which amolding material layer having an intended configuration is formed in themetal mold.

FIG. 38 is an explanatory sectional view partially showing the enlargedmolding material layer.

FIG. 39 is an explanatory sectional view showing a state in which amagnetic field acts on the molding material layer.

FIG. 40 is an explanatory view showing, together with a circuit device,a structure according to an example of an apparatus for inspecting thecircuit device in accordance with the present invention.

FIG. 41 is an explanatory view showing, together with a circuit device,a structure according to another example of the apparatus for inspectingthe circuit device in accordance with the present invention.

FIG. 42 is an explanatory view showing, together with a circuit device,a structure according to yet another example of the apparatus forinspecting the circuit device in accordance with the present invention.

FIG. 43 is an explanatory view showing, together with a circuit device,a structure according to a further example of the apparatus forinspecting the circuit device in accordance with the present invention.

FIG. 44 is an explanatory view showing, together with a circuit device,a structure according to a further example of the apparatus forinspecting the circuit device in accordance with the present invention.

FIG. 45 is an explanatory view showing, together with a circuit device,a structure according to a further example of the apparatus forinspecting the circuit device in accordance with the present invention.

FIG. 46 is an explanatory sectional view showing a state in which aprotective film is formed on the surface of a sheet-like connector.

FIG. 47 is an explanatory sectional view showing the state in which aprotective film is formed on the surface of a sheet-like connector.

FIG. 48 is a top view for explaining the sheet-like connector accordingto the present invention.

FIG. 49 is a plan view showing a circuit device for a test which is usedin the examples.

FIG. 50 is a side view showing the circuit device for a test which isused in the examples.

FIG. 51 is an explanatory view showing the schematic structure of anapparatus for testing a repetitive durability which is used in theexamples.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments (examples) according to the present invention will bedescribed below in more detail based on the drawings.

FIGS. 1 to 3 are explanatory views showing an anisotropically conduciveconnector device according to a first example of the present invention,and FIG. 1 is a plan view showing the anisotropically conduciveconnector device, FIG. 2 is an explanatory view showing an X-X sectionof the anisotropically conducive connector device illustrated in FIG. 1,and FIG. 3 is an explanatory view partially showing an enlarged Y-Ysection of the anisotropically conducive connector device illustrated inFIG. 1.

An anisotropic conductive connector device 10 is constituted by arectangular anisotropic conductive film 10A, a sheet-like connector 20provided integrally on one surface of the anisotropic conductive film10A and a rectangular plate-shaped supporting body 30 which supports theanisotropic conductive film 10A.

The anisotropic conductive film 10A in the anisotropic conductiveconnector device 10 is constituted by a plurality of cylindricalconducting path forming portions 11 extended in a direction of athickness respectively, and an insulating portion 14 for mutuallyinsulating these conducting path forming portions 11. In this example,the conducting path forming portions 11 are disposed at a constant pitchin accordance with the position of a grid point.

Moreover, the anisotropic conductive film 10A is wholly formed by aninsulating elastically polymeric substance and a conductive particle Pexhibiting a magnetism is contained in the conducting path formingportion 11 in an arranging and orienting state in a direction of athickness. On the other hand, the insulating portion 14 does not containor rarely contains the conductive particle.

In the example shown in the drawing, a whole surface in the central partof the anisotropic conductive film 10A is formed in a protruding statefrom a peripheral edge portion. Any of the conducting path formingportions 11, which is formed in the central part of the anisotropicconductive film 10A, is set to be an effective conducting path formingportion 12 which is electrically connected to an electrode to be aconnecting object, for example, an electrode to be inspected in acircuit device to be an inspecting object.

Moreover, any of the conducting path forming portions 11, which isformed on a peripheral edge portion in the anisotropic conductive film10A, is set to be an ineffective conducting path forming portion 13which is not electrically connected to the electrode to be theconnecting object. The effective conducting path forming portion 12 isdisposed in accordance with a pattern corresponding to the pattern ofthe electrode to be the connecting object.

On the other hand, the insulating portion 14 is formed integrally tosurround the individual conducting path forming portions 11.Consequently, all of the conducting path forming portions 11 areinsulated mutually by the insulating portion 14.

Moreover, in the anisotropic conductive connector device 10 according tothis example, a protruded portion 15 for coupling which is protrudedfrom one surface is formed on the insulating portion 14 in the centralpart of the anisotropic conductive film 10A. On the other hand, theother surface of the anisotropic conductive film 10A is provided with aprotruded portion 11A, which is obtained by protruding the surface ofthe conducting path forming portion 11 from the surface of theinsulating portion 14.

A thickness of the effective conducting path forming portion 12 is 0.1to 2 mm, for example, and is preferably 0.2 to 1 mm.

Moreover, a diameter of the effective conducting path forming portion 12is properly set corresponding to the pitch of the electrode to be theconnecting object, and is 50 to 1000 μm, for example, and is preferably200 to 800 μm.

A protrusion height of the protruded portion 11A is 10 to 100 μm, forexample, and is preferably 20 to 60 μm.

The sheet-like connector 20 has a soft insulating sheet 21. In theinsulating sheet 21, a plurality of electrode structures 22 formed of ametal which is extended in the direction of the thickness of theinsulating sheet 21 is disposed apart from each other in the planardirection of the insulating sheet 21 in accordance with a patterncorresponding to the pattern of the electrode to be the connectingobject. Moreover, the insulating sheet 21 is provided with a pluralityof through holes 26 for coupling corresponding to the protruded portion15 for coupling in the anisotropic conductive film 10A.

Each of the electrode structures 22 is constituted by integrallycoupling a protruded surface electrode portion 23 exposed from a surface(an upper surface in the drawing) of the insulating sheet 21 and adisc-shaped back electrode portion 24 exposed from a back face of theinsulating sheet 21 to each other through a short circuit portion 25penetrating and extended in the direction of the thickness of theinsulating sheet 21.

The sheet-like connector 20 is provided integrally on the anisotropicconductive film 10A in such a manner that each of the electrodestructures 22 is positioned on the effective conducting path formingportion 12 of the anisotropic conductive film 10A and the protrudedportion 15 for coupling in the anisotropic conductive film 10A isinserted in the through hole 26 for coupling in the insulating sheet 21.

A thickness of the insulating sheet 21 is 0.005 to 1 mm, for example,and is preferably 0.01 to 0.5 mm and is further preferably 0.015 to 0.3mm.

Moreover, a diameter of the surface electrode portion 23 in theelectrode structure 22 is properly set corresponding to the pitch of theelectrode to be the connecting object, and is 50 to 100 μm, for example,and is preferably 200 to 800 μm.

Furthermore, a protrusion height of the surface electrode portion 23 is10 to 300 μm, for example, and is preferably 50 to 200 μm.

As shown in FIGS. 4 and 5, the supporting body 30 is provided with arectangular opening portion 31 having a smaller dimension than thedimension of the anisotropic conductive film 10A in a central positionthereof and a positioning hole 32 in the positions of four corners ofthe supporting body 30.

The anisotropic conductive film 10A is disposed on the opening portion31 of the supporting body 30 and is supported on the supporting body 30by fixing the peripheral edge portion of the anisotropic conductive film10A to the supporting body 30.

A thickness of the supporting body 30 is 0.01 to 1 mm, for example, andis preferably 0.05 to 0.8 mm.

An elastically polymeric substance forming the anisotropic conductivefilm 10A preferably has a durometer hardness of 15 to 70 and morepreferably 25 to 65. In some cases in which the durometer hardness isexcessively small, a high repetitive durability cannot be obtained.

On the other hand, in some cases in which the durometer hardness isexcessively great, the conducting path forming portion having a highconductivity cannot be obtained.

It is preferable that a polymeric substance having a crosslinkingstructure should be used for an elastically polymeric substance formingthe anisotropic conductive film 10A. Various materials can be used for acuring polymeric substance forming material which can be used forobtaining such an elastically polymeric substance, and specific examplesthereof include:

conjugated diene rubber such as polybutadiene rubber, natural rubber,polyisoprene rubber, styrene-butadiene copolymer rubber oracrylonitrile-butadiene copolymer rubber, and hydrogenated productsthereof;

block copolymer rubber such as styrene-butadiene-diene block terpolymerrubber or styrene-isoprene block copolymer, and hydrogenated productsthereof; and

chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrinrubber, silicone rubber, ethylene-propylene copolymer rubber andethylene-propylene-diene terpolymer rubber, and the like.

As described above, in the case in which a weather resistance isrequired for the anisotropic conductive connector 10 which is obtained,it is preferable to use a material other than the conjugated dienerubber and it is particularly preferable to use the silicone rubber inrespect of molding and processing properties and electricalcharacteristics.

For the silicone rubber, liquid silicone rubber is preferablycrosslinked or condensed. The liquid silicone rubber having a viscosityof 10⁵ poises or less at a shear proportion of 10⁻¹ sec is preferablyused and may be any of a condensation type, an addition type and thosecontaining a vinyl group or a hydroxyl group. Specific examples includedimethyl silicone raw rubber, methylvinyl silicone raw rubber,methylphenylvinyl silicone raw rubber and the like.

Moreover, it is preferable that the silicone rubber should have amolecular weight Mw (which indicates a weight-average molecular weightdetermined in terms of standard polystyrene and hereinafter it has samemeaning) should be 10,000 to 40,000. Moreover, it is preferable that amolecular weight distribution index (which indicates a value of a ratioMw/Mn of a weight-average molecular weight Mw determined in terms ofstandard polystyrene to a number-average molecular weight Mn determinedin terms of standard polystyrene and hereinafter it has same meaning)should be equal to or smaller than 2 because an excellent heatresistance is obtained in the conducting path forming portion 11 whichis acquired.

A conductive particle contained in the conducting path forming portion11 in the anisotropic conductive film 10A can easily be oriented by amethod which will be described below. Therefore, a conductive particleexhibiting a magnetism is used. Specific examples of such a conductiveparticle include:

a particle of a metal having a magnetism such as iron, cobalt or nickel,a particle of their alloy, or a particle containing these metals;

a particle using these particles as a core particle and having thesurface of the core particle which is plated with a metal having a highconductivity, for example, gold, silver, palladium, rhodium or the like;

a particle using, as a core particle, a nonmagnetic metal particle, aninorganic substance particle such as a glass bead or a polymer particleand having the surface of the core particle plated with a conductivemagnetic metal such as nickel or cobalt, and the like.

In particular, it is preferable to use a particle using a nickelparticle as a core particle and having a surface thereof plated withgold having a high conductivity.

While means for coating the surface of the core particle with aconductive metal is not particularly restricted, a chemical plating orelectrolytic plating method, a sputtering method, an evaporation methodor the like is used, for example.

In the case in which there is used a conductive particle obtained bycoating the surface of the core particle with a conductive metal, acoating rate of a conductive metal in the surface of a particle (a rateof a coating area of the conductive metal to a surface area of the coreparticle) is preferably equal to or higher than 40%, is furtherpreferably equal to or higher than 45% and is particularly preferably 47to 95% because a high conductivity can be obtained.

Moreover, a coating amount of the conductive metal is preferably 0.5 to50% by mass of the core particle, is more preferably 2 to 30% by mass,is further preferably 3 to 25% by mass, and is particularly preferably 4to 20% by mass. In the case in which the conductive metal to be coatedis gold, the coating amount is preferably 0.5 to 30% by mass of the coreparticle, is more preferably 2 to 20% by mass and is further preferably3 to 15% by mass.

Furthermore, a particle diameter of the conductive particle ispreferably 1 to 100 μm, is more preferably 2 to 50 μm, is furtherpreferably 3 to 30 μm, and is particularly preferably 4 to 20 μm.

In addition, a particle diameter distribution (Dw/Dn) of the conductiveparticle is preferably 1 to 10, is more preferably 1.01 to 7, is furtherpreferably 1.05 to 5, and is particularly preferably 1.1 to 4.

By using a conductive particle to satisfy such conditions, theconducting path forming portion 11 which is obtained can easily bepressurized and deformed, and furthermore, a sufficient electricalcontact can be obtained between the conductive particles in theconducting path forming portion 11.

Moreover, while the shape of the conductive particle is not particularlyrestricted, it is preferable that the conductive particle should takethe shape of a sphere or a star or should be a secondary particleobtained by aggregating them in view of the point that the conductiveparticle can easily be dispersed in a polymeric substance formingmaterial.

Moreover, it is possible to properly use the surface of the conductiveparticle which is treated with a coupling agent such as a silanecoupling agent or a lubricant. By treating the surface of the particlewith the coupling agent or the lubricant, it is possible to enhance thedurability of the anisotropic conductive connector.

It is desirable that the conductive particle should be used at a rate of5 to 60%, and preferably 7 to 50% in a volume fraction with respect tothe polymeric substance forming material. In some cases in which therate is lower than 5%, the conducting path forming portion 11 having asufficiently small electric resistance value cannot be obtained. On theother hand, in some cases in which the rate is higher than 60%, theconducting path forming portion 11 which is obtained is apt to befragile so that a necessary elasticity for the conducting path formingportion 11 cannot be obtained.

For a material constituting the insulating sheet 21 in the sheet-likeconnector 20, it is possible to use a thermosetting resin such as apolyimide resin or an epoxy resin, or a thermoplastic resin such as apolyester resin such as a polyethylene terephthalate resin or apolybutylene terephthalate resin, a polyvinyl chloride resin, apolystyrene resin, a polyacrylnitrile resin, a polyethylene resin, apolypropylene resin, an acrylic resin, a polybutadiene resin,polyphenylene ether, polyphenylene sulfide, polyamide orpolyoxymethylene, and the thermosetting resin is preferable. In thiscase, particularly, the polyimide resin is preferable in respect of aheat resistance, a dimension stability and the like.

For a material constituting the supporting body 30 which is to be used,a coefficient of linear thermal expansion is preferably equal to orsmaller than 3×10⁻⁵/K, is more preferably 2×10⁻⁵ to 1×10⁻⁶/K and isparticularly preferably 6×10⁻⁶ to 1×10⁻⁶/K.

For a specific material, a metal material or a nonmetal material isused.

For the metal material, it is possible to use gold, silver, copper,iron, nickel, cobalt or their alloy.

For the nonmetal material, it is possible to use:

a resin material having a high mechanical strength such as a polyimideresin, a polyester resin, a polyaramid resin or a polyamide resin;

a composite resin material such as a glass fiber reinforcing type epoxyresin, a glass fiber reinforcing type polyester resin or a glass fiberreinforcing type polyimide resin;

a composite resin material obtained by mixing an inorganic material suchas silica, alumina or boron nitride as a filler into an epoxy resin orthe like, and the like.

In this case, it is preferable to use the composite resin material suchas the polyimide resin or the glass fiber reinforcing type epoxy resinand the composite resin such as the epoxy resin into which the boronnitride is mixed as the filler, in view of the point that a coefficientof linear thermal expansion is small.

According to the anisotropic conductive connector device 10 inaccordance with the first example, the sheet-like connector 20 isprovided integrally on the anisotropic conductive film 10A. Therefore,it is not necessary to align the sheet-like connector 20 with theanisotropic conductive film 10A. Even if the pitch of the electrode tobe a connecting object is small, an excellent electrical connectionstate can be obtained. In addition, also in the case of repetitive usefor a long period of time or the case of use in a high temperatureenvironment, the positional shift of the conducting path forming portion11 from the electrode structure 22 can be prevented from beinggenerated. Accordingly, it is possible to stably maintain an excellentelectrical connection state.

Moreover, the protruded portion 15 for coupling, which is formed on theanisotropic conductive film 10A, is inserted in the through hole 26 forcoupling which is formed on the insulating film 21 in the sheet-likeconnector 20. Therefore, the positional shift of the conducting pathforming portion 11 from the electrode structure 22 can be preventedstill more reliably.

Furthermore, the surface electrode portion 23 of the electrode structure22 in the sheet-like connector 20 is protruded. Therefore, it is alsopossible to achieve an electrical connection reliably for a circuitdevice in which a resist film having a greater thickness than thethickness of the electrode to be the connecting object is formed.

Such an anisotropic conductive connector device 10 can be manufacturedin the following manner, for example.

FIG. 6 is an explanatory sectional view showing a structure according toan example of a metal mold to be used for manufacturing the anisotropicconductive connector device in accordance with the present invention.The metal mold has such a structure that an upper mold 50 and a lowermold 55 making a pair therewith are disposed opposite to each other, anda molding space 65 is formed between a molding surface of the upper mold50 (i.e. a lower surface in FIG. 6) and a molding surface of the lowermold 55(i.e. an upper surface in FIG. 6).

In the upper mold 50, a surface of a ferromagnetic board 51 (i.e. alower surface in FIG. 6) is provided with a ferromagnetic layer 52 inaccordance with an arrangement pattern corresponding to the pattern ofthe conducting path forming portion 11 in the anisotropic conductiveconnector 10 to be intended and a nonmagnetic layer 53 is formed inportions other than the ferromagnetic layer 52, and a molding surface isformed by the ferromagnetic layer 52 and the nonmagnetic layer 53.Moreover, in the upper mold 50, a step is formed on the molding surfaceand a concave portion 54 is formed.

On the other hand, in the lower mold 55, a surface of a ferromagneticboard 56 (i.e. an upper surface in FIG. 6) is provided with aferromagnetic layer 57 in accordance with a pattern corresponding to thepattern of the conducting path forming portion 11 in the anisotropicconductive connector 10 to be intended. In addition, a nonmagnetic layer58 having a greater thickness than the thickness of the ferromagneticlayer 57 is formed in portions other than the ferromagnetic layer 57.Moreover, a step is formed between the nonmagnetic layer 58 and theferromagnetic layer 57. Consequently, a concave portion 59 for formingthe protruded portion 11A in the anisotropic conductive film 10A isformed on the molding surface of the lower mold 55.

As for a material constituting the ferromagnetic boards 51 and 56 in theupper mold 50 and the lower mold 55, it is possible to use aferromagnetic metal such as iron, an iron-nickel alloy, an iron-cobaltalloy, nickel or cobalt. It is preferable that the ferromagnetic boards51 and 56 should have thicknesses of 0.1 to 50 mm and surfaces should besmooth and be subjected to a chemical decreasing treatment or amechanical polishing treatment.

Moreover, a material constituting the ferromagnetic layers 52 and 57 inthe upper mold 50 and the lower mold 55, it is possible to use aferromagnetic metal such as iron, an iron-nickel alloy, an iron-cobaltalloy, nickel or cobalt. It is preferable that the ferromagnetic layers52 and 57 should have thicknesses of 10 μm or more. In the case in whichthe thicknesses are smaller than 10 μm, it is hard to cause a magneticfield having a sufficient intensity distribution to act on a moldingmaterial layer formed in the metal mold. As a result, it is difficult tocollect a conductive particle at a high density in a portion to be theconducting path forming portion 11 in the molding material layer.

Furthermore, as for a material constituting the nonmagnetic layers 53and 58 in the upper mold 50 and the lower mold 55, it is possible to usean on magnetic metal such as copper, a polymeric substance having a heatresistance and the like. It is preferable to use a polymeric substancecured by a radiation in view of the point that the nonmagnetic layers 53and 58 can easily be formed by a photolithographic technique. As forsuch material, it is possible to use a photoresist such as an acryl typedry film resist, an epoxy type liquid resist or a polyimide type liquidresist, for example.

Moreover, the thickness of the nonmagnetic layer 58 in the lower mold 55is set corresponding to the protrusion height of the protruded portion11A to be formed and the thickness of the ferromagnetic layer 57.

By using the metal mold, the anisotropic conductive connector device 10is manufactured in the following manner, for example.

First of all, the sheet-like connector 20 having the structure shown inFIGS. 1 to 3 is manufactured. More specifically, as shown in FIG. 7, alaminating material formed by integrally laminating a metal layer 24A onthe insulating sheet 21 is prepared. Furthermore, as shown in FIG. 8, inaccordance with a pattern corresponding to the pattern of the electrodestructure 22 to be formed, for the insulating sheet 21 in the laminatingmaterial, a plurality of through holes 25H penetrating in the directionof the thickness of the insulating sheet 21 is formed.

Next, as shown in FIG. 9, a plating treatment is carried out over thelaminating material so that the short circuit portion 25, which iscoupled integrally to the metal layer 24A, is formed in the through hole25H of the insulating sheet 21 and so that the protruded surfaceelectrode portion 23, which is coupled integrally with the short circuitportion 25, is formed on the surface of the insulating sheet 21.

Thereafter, a photo etching treatment is carried out over the metallayer 24A in the laminating material and a part thereof is thus removed.Consequently, as shown in FIG. 10, the back electrode portion 24 coupledintegrally with the short circuit portion 25 is provided to form theelectrode structure 22. In addition, as shown in FIG. 11, the throughhole 26 for coupling is formed on the insulating sheet 21 so that thesheet-like connector 20 is obtained.

In the foregoing, as for the method of forming the through hole 25H andthe through hole 26 for coupling on the insulating sheet 21, it ispossible to utilize a laser processing method, a dry etching method orthe like.

As for a plating method for forming the short circuit portion 25 and thesurface electrode portion 23, it is possible to utilize an electrolyticplating method or a nonelectrolytic plating method.

Subsequently, as shown in FIG. 12, two frame-shaped spacers 60 and 61and the supporting body 30 are prepared and as shown in FIG. 12, thesupporting body 30 is fixed to a predetermined position of the lowermold 55 through the spacer 61, and furthermore, the spacer 60 isdisposed on the supporting body 30.

On the other hand, a conductive particle exhibiting a magnetism isdispersed into a liquid polymeric substance forming material to be anelastically polymeric substance by curing. As a result, a moldingmaterial for forming an anisotropic conductive film is prepared.

Thereafter, as shown in FIG. 13, the protective film 62 is disposed inthe concave portion 54 on the molding surface of the upper mold 50, andfurthermore, the sheet-like connector 20 is aligned on the protectingfilm 62 in such a manner that each of the electrode structures 22 ispositioned on the ferromagnetic layer 52. In this state, the surfaceelectrode portion 23 of the electrode structure 22 is disposed incontact with the protective film 62.

Next, as shown in FIG. 14, the concave portion 54 of the upper mold 50is filled with a molding material. Consequently, a molding materiallayer 17 containing a conductive particle exhibiting a magnetism in apolymeric substance forming material is formed in the concave portion54, and furthermore, a molding material is filled in a space formed bythe lower mold 55, the spacers 60 and 61, and the supporting body 30.

As a result, a molding material layer 18 containing a conductiveparticle exhibiting a magnetism in the polymeric substance formingmaterial is formed in the space, and furthermore, the upper mold 50 isaligned on the spacer 60. Consequently, a molding material layer 19having a final configuration is formed in the metal mold as shown inFIG. 15.

In this state, the molding material layer 19 is formed on the moldingsurface of the lower mold 55 in the metal mold, and furthermore, thesheet-like connector 20 is disposed on the molding material layer 19. Inaddition, the protective film 62 is disposed between the sheet-likeconnector 20 and the molding surface of the upper mold 50.

Moreover, in the molding material layer 19, a conductive particle P isset in a dispersion state in the molding material layer 19 as shown inFIG. 16.

Subsequently, an electromagnet (not shown), which is provided on theupper surface of the ferromagnetic board 51 in the upper mold 50 and thelower surface of the ferromagnetic board 56 in the lower mold 55, isoperated. As a result, a parallel magnetic field having an intensitydistribution, that is, a parallel magnetic field having a high intensitybetween the ferromagnetic layer 52 of the upper mold 50 and theferromagnetic layer 57 of the lower mold 55 corresponding thereto iscaused to act in a direction of a thickness of the molding materiallayer 19.

As a result, as shown in FIG. 17, in the molding material layer 19, theconductive particle dispersed in the molding material layer 19 iscollected in the portion, which is to be the conducting path formingportion 11 positioned between each ferromagnetic layer 52 of the uppermold 50 and the ferromagnetic layer 57 of the lower mold 55corresponding thereto. Furthermore, the conductive particle is orientedto be arranged in the direction of the thickness of the molding materiallayer 19.

In this state, the molding material layer 19 is subjected to a curingtreatment. Consequently, the anisotropic conductive film 10A having theconducting path forming portion 11, which is filled densely with theconductive particle in the elastically polymeric substance in anarranging and orienting state in the direction of the thickness, andhaving the insulating portion 14 formed of an insulating elasticallypolymeric substance, which is formed to surround the conducting pathforming portion 11 and in which the conductive particle is not presentat all or is rarely present, is formed in a state in which thesheet-like connector 20 is integrally bonded to a surface thereof and aperipheral portion thereof is fixed to and supported on the supportingbody 30.

Consequently, the anisotropic conductive connector 10 having thestructure shown in FIGS. 1 to 3 is manufactured.

In the foregoing, as for a material for forming the protective film 62,it is possible to use a resin material such as a resist material, afluororesin or a polyimide resin.

Although the curing treatment for the molding material layer 19 can alsobe carried out in a state in which a parallel magnetic field ismaintained to act, it can also be carried out after the action of theparallel magnetic field is stopped.

It is preferable that the intensity of the parallel magnetic field toact on each molding material layer should be 20,000 to 1,000,000 μT onaverage.

Moreover, as means for causing the parallel magnetic field to act oneach molding material layer, it is also possible to use a permanentmagnet in place of the electromagnet. It is preferable that thepermanent magnet should be formed of alnico (an Fe—Al—Ni—Co type alloy),ferrite or the like in view of the point that the intensity of theparallel magnetic field within the range described above can beobtained.

While the curing treatment for the molding material layer 19 is properlyselected depending on a material to be used, it is usually carried outby a heating treatment. A specific heating temperature and a specificheating time are properly selected in consideration of a type of thepolymeric substance forming material constituting the molding materiallayer, a time required for moving the conductive particle and the like.

According to such a manufacturing method, the molding material layer 19is subjected to the curing treatment in a state in which the sheet-likeconnector 20 is disposed on the molding material layer 19 for formingthe anisotropic conductive film 10A. Therefore, it is possible toadvantageously and reliably manufacture the anisotropic conductiveconnector device 10 in which the sheet-like connector 20 is providedintegrally on the anisotropic conductive film 10A.

Moreover, the protective film 62 is disposed between the molding surfaceof the upper mold 50 and the sheet-like connector 20. Consequently, itis possible to prevent the molding surface of the upper mold 50 and theelectrode structure 22 of the sheet-like connector 20 from beingdamaged. Furthermore, it is also possible to prevent a molding materialfrom entering a surface of the sheet-like connector 20 (a surface on theupper mold 50 side).

FIGS. 18 to 20 are explanatory views showing an anisotropic conductiveconnector device according to a second example of the present invention,and FIG. 18 is a plan view showing the anisotropic conductive connectordevice, FIG. 19 is an explanatory view showing an X-X section of theanisotropic conductive connector device illustrated in FIG. 18 and FIG.20 is an explanatory view partially showing an enlarged Y-Y section ofthe anisotropic conductive connector device illustrated in FIG. 18.

An anisotropic conductive connector device 10 according to the secondexample is constituted by a rectangular anisotropic conductive film 10A,a sheet-like connector 20 provided integrally on one surface of theanisotropic conductive film 10A and a rectangular plate-shapedsupporting body 30 which supports the anisotropic conductive film 10A.In addition, the anisotropic conductive film 10A and the supporting body30 have the same structures as those of the anisotropic conductiveconnector device according to the first example.

The sheet-like connector 20 in the anisotropic conductive connectordevice 10 according to the second example has the same structure as thesheet-like connector 20 in the anisotropic conductive connector device10 according to the first example except for an electrode structure 22.

Each electrode structure 22 is constituted by integrally coupling asurface electrode portion 23 taking the shape of a circular ring plate,which is exposed from a surface (an upper surface in the drawing) of aninsulating sheet 21, and a back electrode portion 24 taking the shape ofa circular ring plate, which is exposed from a back face of theinsulating sheet 21, to each other via a cylindrical short circuitportion 25 (a through hole) penetrating and extended in the direction ofthe thickness of the insulating sheet 21.

Such a sheet-like connector 20 can be manufactured in the followingmanner.

First of all, as shown in FIG. 21, a laminating material obtained byintegrally laminating metal layers 23A and 24A on both sides of theinsulating sheet 21 is prepared. Furthermore, as shown in FIG. 22, forthe laminating material, in accordance with a pattern corresponding tothe pattern of the electrode structure 22 to be formed, a plurality ofthrough holes 25H penetrating in the direction of the thickness of thelaminating material is formed.

Subsequently, the laminating material is subjected to a platingtreatment so that, as shown in FIG. 23, the short circuit portion 25which is coupled integrally with each of the metal layers 23A and 24A isformed in the through hole H in the laminating material.

Then, each of the metal layers 23A and 24A in the laminating material issubjected to a photo etching treatment and a part thereof is thusremoved. As shown in FIG. 24, consequently, the surface electrodeportion 23 and the back electrode portion 24 which are coupledintegrally through the short circuit portion 25 are formed on both sidesof the insulating sheet 21, so that the electrode structure 22 isformed.

Thereafter, as shown in FIG. 25, a through hole 26 for coupling isformed on the insulating sheet 21 so that the sheet-like connector 20 isobtained.

The anisotropic conductive connector device 10 according to the secondexample can be manufactured in the same manner as the anisotropicconductive connector device according to the first example except that asheet-like connector 20 shown in FIG. 25 is used in place of thesheet-like connector 20 shown in FIG. 11.

According to the anisotropic conductive connector device 10 inaccordance with the second example, the sheet-like connector 20 isprovided integrally on the anisotropic conductive film 10A. Therefore,it is not necessary to align the sheet-like connector 20 with theanisotropic conductive film 10A. Consequently, even if the pitch of anelectrode to be a connecting object is small, an excellent electricalconnection state can be obtained. In addition, the positional shift ofthe conducting path forming portion 11 from the electrode structure 22is not generated also in the case of repetitive use for a long period oftime or the case of use in a high temperature environment. Accordingly,it is possible to stably maintain an excellent electrical connectionstate.

Moreover, a protruded portion 15 for coupling, which is formed on theanisotropic conductive film 10A, is inserted in the through hole 26 forcoupling, which is formed on the insulating sheet 21 in the sheet-likeconnector 20. Therefore, the positional shift of the conducting pathforming portion 11 from the electrode structure 22 can be preventedstill more reliably.

Furthermore, the surface electrode portion 23 of the electrode structure22 in the sheet-like connector 20 takes the shape of a protruded plate.Therefore, even if the electrode to be the connecting object isprotruded, the conducting path forming portion 11 can be prevented frombeing excessively pressurized. Accordingly, also in the case ofrepetitive use, it is possible to obtain a stable conductivity for along period of time in the conducting path forming portion 11.

FIGS. 26 to 28 are explanatory views showing an anisotropic conductiveconnector device according to a third example of the present invention,and FIG. 26 is a plan view showing the anisotropic conductive connectordevice, FIG. 27 is an explanatory view showing an X-X section of theanisotropic conductive connector device illustrated in FIG. 26 and FIG.28 is an explanatory view partially showing an enlarged Y-Y section ofthe anisotropic conductive connector device illustrated in FIG. 26.

An anisotropic conductive connector device 10 according to the secondexample is constituted by a rectangular anisotropic conductive film 10A,a sheet-like connector 20 provided integrally on one surface of theanisotropic conductive film 10A and a rectangular plate-shapedsupporting body 30 which supports the anisotropic conductive film 10A.In addition, the anisotropic conductive film 10A and the supporting body30 have the same structures as those of the anisotropic conductiveconnector device according to the first example.

In the anisotropic conductive connector device 10 according to the thirdexample, the sheet-like connector 20 has an insulating sheet 21 formedby a mesh, a nonwoven fabric or a porous sheet in which a voidcommunicating with both sides of the insulating sheet is provided. Aplurality of electrode structures 22 formed of a metal, which isextended in the direction of the thickness of the insulating sheet 21,is disposed apart from each other in the planar direction of theinsulating sheet 21 in accordance with a pattern corresponding to thepattern of an electrode to be a connecting object in the insulatingsheet 21.

Each of the electrode structures 22 penetrates and is extended in thedirection of the thickness of the insulating sheet 21 and is coupledintegrally with the insulating sheet.

In the sheet-like connector 20, each of the electrode structures 22 ispositioned on an effective conducting path forming portion 12 of theanisotropic conductive film 10A and is integrated on the anisotropicconductive film 10A.

A thickness of the insulating sheet 21 formed by the mesh, the nonwovenfabric or the porous sheet is 0.005 to 1 mm, for example, and ispreferably 0.01 to 0.5 mm and is further preferably 0.015 to 0.3 mm.

Moreover, a diameter of the electrode structure 22 is properly setcorresponding to the pitch of the electrode to be the connecting objector the like, and is 50 to 1000 μm, for example, and is preferably 200 to800 μm.

Furthermore, a protrusion height of the electrode structure 22 from theinsulating sheet is 10 to 300 μm, for example, and is preferably 50 to200 μm.

It is possible to suitably use the mesh or nonwoven fabric constitutingthe insulating sheet 21 which is formed by an organic fiber. Examples ofsuch an organic fiber include a fluororesin fiber such as apolytetrafluoroethylene fiber, an aramid fiber, a polyethylene fiber, apolyallylate fiber, a nylon fiber, a polyester fiber, and the like.

By using an organic fiber in which a coefficient of linear thermalexpansion is equal to or approximates to a coefficient of linear thermalexpansion of a material forming a connecting object, more specifically,a coefficient of linear thermal expansion is 30×10⁻⁶ to −5×10⁻⁶/K,particularly, 10×10⁻⁶ to −3×10⁻⁶/K, moreover, it is possible to suppressthe thermal expansion of the anisotropic conductive film. Therefore,also in the case in which a thermal history caused by a change in atemperature is received, it is possible to stably maintain an excellentelectrical connection state for the connecting object.

Furthermore, it is preferable to use an organic fiber having a diameterof 10 to 200 μm.

In addition, it is possible to use, for the porous sheet, a porous thinfilm resin sheet or the like which is provided with a large number ofopenings by a treatment such as a laser perforating process or etching.

According to the anisotropic conductive connector device 10 inaccordance with the third example, a material, which constitutes ananisotropic conductive film, or an adhesive, which bonds the anisotropicconductive film and the sheet-like connector, are cured in a permeationstate into the void of the insulating sheet 21. Therefore, thesheet-like connector 20 is integrated on the anisotropic conductive film10A. Thus, the sheet-like connector is integrated with the anisotropicconductive film thereon and cannot be moved mutually to positions.

Therefore, it is not necessary to align the sheet-like connector 20 withthe anisotropic conductive film 10A. Even if the pitch of an electrodeto be a connecting object is small, consequently, an excellentelectrical connection state can be obtained. In addition, also in thecase of repetitive use for a long period of time or the case of use in ahigh temperature environment, the positional shift of the conductingpath forming portion 11 from the electrode structure 22 is notgenerated. Accordingly, it is possible to stably maintain an excellentelectrical connection state.

Moreover, the insulating sheet 21 in the sheet-like connector 20 isconstituted by the insulating sheet 21 formed by the mesh, the nonwovenfabric or the porous sheet in which the void communicating with bothsides of the insulating sheet is formed. Therefore, the positional shiftof the conducting path forming portion 11 from the electrode structure22 can be prevented still more reliably.

Furthermore, the electrode structure 22 in the sheet-like connector 20is protruded. Therefore, it is also possible to reliably achieve anelectrical connection for a circuit device in which a resist film havinga greater thickness than the thickness of the electrode to be theconnecting object is formed.

The anisotropic conductive connector device 10 according to the thirdexample can be manufactured in the following manner, for example.

More specifically, the anisotropic conductive connector device 10 ismanufactured in the following manner by using the metal mold includingthe upper mold 50 and the lower mold 55 shown in FIG. 6, for example.

First of all, the sheet-like connector 20 having the structure shown inFIGS. 26 to 28 is manufactured. More specifically, the insulating sheet21 formed by a mesh or a nonwoven fabric is prepared as shown in FIG.29.

As shown in FIG. 30, a resist layer 70 formed of a dry film resist orthe like is provided on the insulating sheet 21, for example.

For the insulating sheet 21 having the resist layer formed thereon, asshown in FIG. 31, a plurality of pattern holes 75 is formed on theresist layer 70 in accordance with a pattern corresponding to thepattern of the electrode structure 22 to be formed.

Subsequently, the laminating material is subjected to a platingtreatment. Consequently, the electrode structure 22 coupled to theinsulating sheet 21 formed by the mesh or the nonwoven fabric is formedin the pattern hole 75 of the resist layer 70 as shown in FIG. 32.

Then, the resist layer is removed from the laminating material layer.Consequently, the sheet-like connector 20 is obtained as shown in FIG.33.

In the foregoing, as for a plating method for forming the electrodestructure 22, it is possible to utilize an electrolytic plating methodor a nonelectrolytic plating method.

The anisotropic conductive connector device 10 according to the thirdexample can be manufactured as shown in FIGS. 34 to 39 in the samemanner as the anisotropic conductive connector device according to thefirst example except that the sheet-like connector 20 shown in FIG. 33is used in place of the sheet-like connector 20 shown in FIG. 11.Accordingly, detailed description will be omitted.

According to such a manufacturing method, in a state in which thesheet-like connector 20 is disposed on a molding material layer 19 forforming the anisotropic conductive film 10A, a material constituting theanisotropic conductive film is cured in a permeation condition into thevoid of the insulating sheet 21. Consequently, the molding materiallayer 19 is subjected to a curing treatment. Thus, it is possible toadvantageously and reliably manufacture the anisotropic conductiveconnector device 10 in which the sheet-like connector 20 is integratedon the anisotropic conductive film 10A.

FIG. 40 is an explanatory view showing a schematic structure accordingto an example of an apparatus for inspecting a circuit device inaccordance with the present invention.

The apparatus for inspecting a circuit device is provided with a circuitboard 40 for an inspection having a guide pin 42. An electrode 41 for aninspection is formed on a surface of the circuit board 40 for aninspection (an upper surface in FIG. 1) in accordance with a patterncorresponding to the pattern of an electrode 2 to be inspected in acircuit device 1 to be an inspecting object. The electrode 2 to beinspected in the circuit device 1 is a pad electrode.

The anisotropic conductive connector device 10 according to the firstexample is provided on the surface of the circuit board 40 for aninspection.

More specifically, the guide pin 42 is inserted in a positioning hole 32(see FIGS. 1 and 3) formed on the supporting body 30 in the anisotropicconductive connector device 10. Consequently, the anisotropic conductiveconnector device 10 is fixed onto the surface of the circuit board 40for an inspection in a state in which an effective conducting pathforming portion 12 in the anisotropic conductive film 10A is positionedto be placed on the electrode 41 for an inspection.

In the apparatus for inspecting a circuit device, the circuit device 1is disposed on the anisotropic conductive connector device 10 in such amanner that the electrode 2 to be inspected in the circuit device 1 ispositioned on a surface electrode portion 23 of the electrode structure22 in the sheet-like connector 20.

In this state, the circuit device 1 is pressed in such a direction as toapproach a circuit board 40 for an inspection, for example.Consequently, each of the effective conducting path forming portions 12in the anisotropic conductive connector device 10 is interposed bypressure between the electrode structure 22 in the sheet-like connector20 and the electrode 41 for an inspection.

As a result, an electrical connection between the electrode 2 to beinspected in the circuit device 1 and each electrode 41 for aninspection in the circuit board 40 for an inspection is achieved throughthe electrode structure 22 of the sheet-like connector 20 and theeffective conducting path forming portion 12 of the anisotropicconductive film 10A. In addition, in this inspecting state, the circuitdevice 1 is inspected.

According to the apparatus for inspecting a circuit device, theanisotropic conductive connector device 10 according to the firstexample is provided. Therefore, also in the case of repetitive use for along period of time or the case of use in a high temperatureenvironment, it is possible to stably maintain an excellent electricalconnection state.

Moreover, the surface electrode portion 23 of the electrode structure 22in the sheet-like connector 20 is protruded. Even if the circuit device1 to be an inspecting object is provided with a resist film having agreater thickness than the thickness of the electrode 2 to be inspected,therefore, it is possible to reliably achieve an electrical connectionto the circuit device 1.

FIG. 41 is an explanatory view showing a schematic structure accordingto another example of the apparatus for inspecting a circuit device inaccordance with the present invention.

The apparatus for inspecting a circuit device is provided with a circuitboard 40 for an inspection which has a guide pin 42. An electrode 41 foran inspection is formed on a surface (an upper surface in FIG. 1) of thecircuit board 40 for an inspection in accordance with a patterncorresponding to the pattern of the electrode 2 to be inspected in thecircuit device 1 to be an inspecting object.

The electrode 2 to be inspected in the circuit device 1 is a protruded(hemispherical) solder ball electrode.

The anisotropic conductive connector device 10 according to the secondexample is disposed on the surface of the circuit board 40 for aninspection.

More specifically, the guide pin 42 is inserted in a positioning hole 32(see FIGS. 1 and 3) formed on the supporting body 30 in the anisotropicconductive connector device 10. Consequently, the anisotropic conductiveconnector device 10 is fixed onto the surface of the circuit board 40for an inspection in a state in which an effective conducting pathforming portion 12 in an anisotropic conductive film 10A is positionedto be placed on the electrode 41 for an inspection.

According to the apparatus for inspecting a circuit device, theanisotropic conductive connector device 10 according to the secondexample is provided. Therefore, also in the case of repetitive use for along period of time or the case of use in a high temperatureenvironment, it is possible to stably maintain an excellent electricalconnection state.

Furthermore, a surface electrode portion 23 of an electrode structure 22in a sheet-like connector 20 takes the shape of a protruded plate. Evenif the electrode 2 to be inspected is protruded, therefore, theconducting path forming portion 11 can be prevented from beingexcessively pressurized. Also in the case of repetitive use,accordingly, it is possible to obtain a stable conductivity for a longperiod of time in the conducting path forming portion 11.

FIG. 42 is an explanatory view showing a schematic structure accordingto yet another example of the apparatus for inspecting a circuit devicein accordance with the present invention.

The apparatus for inspecting a circuit device is provided with a circuitboard 40 for an inspection which has a guide pin 42. An electrode 41 foran inspection is formed on a surface (an upper surface in FIG. 1) of thecircuit board 40 for an inspection in accordance with a patterncorresponding to the pattern of the electrode 2 to be inspected in thecircuit device 1 to be an inspecting object. The electrode 2 to beinspected in the circuit device 1 is a pad electrode in the same manneras in FIG. 40.

The anisotropic conductive connector device 10 according to the thirdexample is provided on the surface of the circuit board 40 for aninspection in the same manner as in FIG. 40.

According to the apparatus for inspecting a circuit device in accordancewith the present example, the anisotropic conductive connector device 10according to the first example is provided. Also in the case ofrepetitive use for a long period of time or the case of use in a hightemperature environment, therefore, it is possible to stably maintain anexcellent electrical connection state.

Moreover, the electrode structure 22 in the sheet-like connector 20 isprotruded. Even if the circuit device 1 to be an inspecting object isprovided with a resist film having a greater thickness than thethickness of the electrode 2 to be inspected, therefore, it is possibleto reliably achieve an electrical connection to the circuit device 1.

FIG. 43 is an explanatory view showing a schematic structure accordingto a further example of the apparatus for inspecting a circuit device inaccordance with the present invention.

The apparatus for inspecting a circuit device is provided with a circuitboard 40 for an inspection which has a guide pin 42. An electrode 41 foran inspection is formed on a surface (an upper surface in FIG. 1) of thecircuit board 40 for an inspection in accordance with a patterncorresponding to the pattern of the electrode 2 to be inspected in thecircuit device 1 to be an inspecting object. The electrode 2 to beinspected in the circuit device 1 is a protruded (hemispherical) solderball electrode in the same manner as in FIG. 41.

The anisotropic conductive connector device 10 according to the thirdexample is disposed on the surface of the circuit board 40 for aninspection in the same manner as in FIG. 41.

According to the apparatus for inspecting a circuit device in accordancewith the present example, the anisotropic conductive connector device 10according to the third example is provided. Also in the case ofrepetitive use for a long period of time or the case of use in a hightemperature environment, therefore, it is possible to stably maintain anexcellent electrical connection state.

Furthermore, an electrode structure 22 in a sheet-like connector 20takes the shape of a protruded plate. Even if the electrode 2 to beinspected is protruded, therefore, the conducting path forming portion11 can be prevented from being excessively pressurized. Accordingly,aqlso in the case of repetitive use, it is possible to obtain a stableconductivity for a long period of time in the conducting path formingportion 11.

FIG. 44 is an explanatory view showing a schematic structure accordingto a further example of the apparatus for inspecting a circuit device inaccordance with the present invention.

More specifically, in the anisotropic conductive connector deviceaccording to the present example, the conducting path forming portionsare disposed at a constant pitch irrespective of the pattern of theelectrode to be inspected. In addition, parts of these conducting pathforming portions are set to be effective conducting path formingportions to be electrically connected to the electrode to be inspected.Furthermore, the other conducting path forming portions are set to beineffective conducting path forming portions which are not electricallyconnected to the electrode to be inspected.

More specifically, as shown in FIG. 44, a circuit device 1 to be aninspecting object has such a structure that an electrode 2 to beinspected is disposed in only a part of grid point positions at aconstant pitch in a CSP (Chip Scale Package), TSOP (Thin Small OutlinePackage) or the like, for example.

In the present example, the anisotropic conductive connector device 10according to the first example is used in the apparatus for inspecting acircuit device.

In the anisotropic conductive connector device 10 for inspecting thecircuit device 1, a conducting path forming portion 11 is provided inaccordance with grid point positions at a substantially equal pitch tothat in the electrode 2 to be inspected. In addition, the conductingpath forming portion 11 placed in a position corresponding to theelectrode 2 to be inspected is set to be an effective conducting pathforming portion 12. Moreover, the other conducting path forming portions11 are set to be ineffective conducting path forming portions 13.

According to the anisotropic conductive connector device 10 having sucha structure, in the manufacture of the anisotropic conductive connectordevice 10, the ferromagnetic layers of the metal mold are disposed at aconstant pitch. Consequently, a conductive particle can be efficientlycollected and oriented in a predetermined position when a magnetic fieldis caused to act on a molding material layer.

Thus, the density of the conductive particle is uniform in each of theconducting path forming portions which are obtained. Consequently, it ispossible to obtain an anisotropic conductive connector device having asmall difference in a resistance value of each conducting path formingportion.

FIG. 45 is an explanatory view showing a schematic structure accordingto a further example of the apparatus for inspecting a circuit device inaccordance with the present invention.

In the apparatus for inspecting a circuit device according to thepresent example, in the same manner as in FIG. 44, a circuit device 1 tobe an inspecting object has such a structure that an electrode 2 to beinspected is disposed in only a part of grid point positions at aconstant pitch in a CSP (Chip Scale Package), TSOP (Thin Small OutlinePackage) or the like, for example.

In the anisotropic conductive connector device 10 for inspecting thecircuit device 1, a conducting path forming portion 11 is provided inaccordance with grid point positions at a substantially equal pitch tothat in the electrode 2 to be inspected. In addition, the conductingpath forming portion 11 placed in a position corresponding to theelectrode 2 to be inspected is set to be an effective conducting pathforming portion 12. Moreover, the other conducting path forming portions11 are set to be ineffective conducting path forming portions 13.

In the present example, the anisotropic conductive connector device 10according to the third example is used in the apparatus for inspecting acircuit device.

Also in the anisotropic conductive connector device 10 having such astructure, in the manufacture of the anisotropic conductive connectordevice 10, the ferromagnetic layers of the metal mold are disposed at aconstant pitch. Consequently, a conductive particle can be efficientlycollected and oriented in a predetermined position when a magnetic fieldis caused to act on a molding material layer.

Thus, the density of the conductive particle is uniform in each of theconducting path forming portions which are obtained. Consequently, it ispossible to obtain an anisotropic conductive connector device having asmall difference in a resistance value of each conducting path formingportion.

EXAMPLE 1

 1) Manufacture of Sheet-like Connector

A dry film resist (Photek: H-9050) was laminated on both sides of a mesh(thickness: 0.042 mm, opening diameter: 54 μm, opening ratio: 49%)formed by a polyallylate type composite fiber (fiber diameter: 23 μm)and a laminating material having the structure shown in FIG. 30 wasobtained.

The thickness of the laminating material obtained after the laminationwas 0.12 mm.

A photomask film having an opening in a diameter of 0.3 mm and a pitchof 0.8 mm was aligned and laminated on both sides of the laminatingmaterial in such a manner that an opening portion was coincidenttherewith. Furthermore, the dry film resist layer was exposed by using aparallel ray exposing machine (manufactured by ORC SEISAKUSHO) and wasthen developed so that the laminating material having an opening portionpenetrating through upper and lower surfaces shown in FIG. 31 wasobtained.

The laminating material having the opening portion thus obtained wassubjected to a nonelectrolytic plating treatment by using a copperplating solution (OKUNO CHEMICAL INDUSTRIES CO., LTD.:BVF) so that alaminating material having the electrode structure (22) formed in theopening portion shown in FIG. 32 was obtained.

Next, the resist was peeled to obtain the sheet-like connector (20)including the electrode structure (22) shown in FIG. 33.

In the sheet-like connector thus obtained, the electrode structure had adiameter of 0.3 mm, thickness of 0.12 mm and an arrangement pitch of 0.8mm.

The sheet-like connector was cut into 14 mm×7.5 mm and a dry film resistwas laminated as the protective film (62) on either side and was usedfor manufacturing the anisotropic conductive connector.

 2) Fabrication of Supporting Body and Metal Mold:

A supporting body having the following specification was fabricated inaccordance with the structure shown in FIG. 4, and furthermore, a metalmold for molding an anisotropic conductive film having the followingspecification was fabricated in accordance with the structure shown inFIG. 6.

 [Supporting Body]

The supporting body (30) is formed by SUS304 and has a thickness of 0.1mm, and the opening portion (31) has a dimension of 17 mm×10 mm and isprovided with a positioning hole (32) on four corners.

 [Metal Mold]

The ferromagnetic boards (51, 56) in the upper mold (50) and the lowermold (55) are formed of iron and have a thickness of 6 mm.

The ferromagnetic layers (52, 57) in the upper mold (50) and the lowermold (55) are formed of nickel and have a diameter of 0.45 mm (circle),a thickness of 0.1 mm and an arrangement pitch (a distance betweencenters) of 0.8 mm, and the number of the ferromagnetic layers is 288(12×24).

The nonmagnetic layers (53, 58) in the upper mold (50) and the lowermold (55) are formed by a material obtained by carrying out a curingtreatment over a dry film resist. In the nonmagnetic layer (53) in theupper mold (50), a portion (53 a) has a thickness of 0.3 mm and aportion (53 b) has a thickness of 0.1 mm. The nonmagnetic layer (58) inthe lower mold (55) has a thickness of 0.15 mm.

The concave portion (54) formed in the upper mold has a dimension of 15mm by 8 mm and a depth of 0.2 mm.

 3) Preparation of Molding Material

60 parts by weight of a conductive particle having an average particlediameter of 30 μm was added to 100 parts by weight of addition typeliquid silicone rubber. Furthermore, they were mixed, and a defoamingtreatment was then carried out at a reduced pressure so that a moldingmaterial for forming an anisotropic conductive film was prepared. In theforegoing, there was used a conductive particle formed by plating a coreparticle formed of nickel with gold (average coating amount 20% byweight with respect to the weight of the core particle)

 4) Formation of Anisotropic conductive Film

A side of the sheet-like connector (20) on which the protective layer(62) is provided was set to be a metal mold side, and the electrodestructure and the ferromagnetic layer (52) of the metal mold werearranged in alignment with each other in the concave portion (54) of theupper mold (50) of the metal mold (see FIG. 35).

Next, the molding material thus prepared was applied by screen printingto form the first molding material layer (17) having a thickness of 0.2mm which is obtained by containing a conductive particle and areinforcing material in liquid addition type silicon rubber (see FIG.36).

Moreover, the spacer (61) having a thickness of 0.1 mm, in which arectangular opening portion having a dimension of 20 mm by 13 mm isformed, was aligned and disposed on the molding surface in the lowermold (55) of the metal mold. In addition, the supporting body (30) wasaligned and arranged on the spacer (61). Furthermore, the spacer (60)having a thickness of 0.2 mm, in which a rectangular opening portionhaving a dimension of 20 mm by 13 mm is formed, was aligned and disposedon the supporting body (30) (see FIG. 34).

Then, the molding material prepared as described above was applied bythe screen printing. As a result, the second molding material layer(18), which was obtained by containing the conductive particle in theliquid addition type silicone rubber and having a thickness of 0.3 mm ina portion positioned on the nonmagnetic layer (58), was formed in aspace constituted by the lower mold (55), the spacer (60, 61) and thesupporting body (30) (see FIG. 36).

Then, the first molding material layer (17) formed in the upper mold(50) and the second molding material layer (18) formed in the lower mold(55) were aligned and superposed to form the lamination molding materiallayer (19) (see FIGS. 37 and 38).

Thereafter, while a magnetic field of 2T was applied in a direction of athickness by means of an electromagnet to a portion positioned betweenthe ferromagnetic layers (52, 57) for the lamination molding materiallayer (19) formed between the upper mold (50) and the lower mold (51),the curing treatment was carried out at 100° C. for one hour. Thus, theanisotropic conductive film (10A) was formed (see FIG. 39).

The metal mold was opened and the protective film (62) on the surface ofthe sheet-like connector which is provided on one surface side of theanisotropic conductive connector thus obtained was removed.

As described above, the anisotropic conductive connector (10) accordingto the present invention was manufactured. The anisotropic conductivefilm (10A) in the anisotropic conductive connector (10) thus obtainedhas a dimension of 20 mm by 13 mm and takes a rectangular shape. Inaddition, the thickness of the conducting path forming portion (11) is0.65 mm including the thickness of the electrode structure. Furthermore,the insulating portion (14) has a thickness of 0.6 mm. Moreover, 288(12×24) conducting path forming portions (11) are provided, and eachconducting path forming portion (11) has a diameter of 0.45 mm, theconducting path forming portion (11) has an arrangement pitch (adistance between centers) of 0.8 mm. In addition, and the electrodestructure (22) of the sheet-like connector provided on the conductingpath forming portion (12) has a diameter of 0.3 mm and a thickness of0.12 mm.

The anisotropic conductive connector will be hereinafter referred to asan “anisotropic conductive connector A”.

COMPARATIVE EXAMPLE 1

An anisotropic conductive connector was manufactured in the same manneras in the example 1 except that the sheet-like connector was notdisposed in the concave portion of the upper mold (50). The anisotropicconductive film in the anisotropic conductive connector thus obtainedhas a dimension of 20 mm by 13 mm and takes a rectangular shape, aconducting path forming portion has a thickness of 0.65 mm, aninsulating portion has a thickness of 0.6 mm. In addition, 288 (12×24)conducting path forming portions are provided, and each conducting pathforming portion has a diameter of 0.45 mm and the conducting pathforming portion has an arrangement pitch (a distance between centers) of0.8 mm.

The anisotropic conductive connector will be hereinafter referred to asan “anisotropic conductive connector B”.

[Evaluation of Anisotropic Conductive Connector]

Referring to the anisotropic conductive connector A according to theexample 1 and the anisotropic conductive connector B according to thecomparative example 1, a performance evaluation was carried out in thefollowing manner.

In order to evaluate the anisotropic conductive connector A according tothe example 1 and the anisotropic conductive connector B according tothe comparative example 1, a circuit device 3 for a test shown in FIGS.49 and 50 was prepared.

The circuit device 3 for a test has 72 solder ball electrodes 2(material: 64 solder) in total, each of which has a diameter of 0.4 mmand a height of 0.3 mm. Two electrode groups are formed, each of whichhas 36 solder ball electrodes 2 provided therein. In each of theelectrode groups, there are formed two lines in total, each of which has18 solder ball electrodes 2 arranged straight at a pitch of 0.8 mm. Twoof the solder ball electrodes are electrically connected to each otherthrough a wiring 8 in the circuit device 3. The total number of thewirings in the circuit device 3 is 36.

By using such a circuit device for a test, the anisotropic conductiveconnector A according to the example 1 and the anisotropic conductiveconnector B according to the comparative example 1 were evaluated in thefollowing manner.

 <<Initial Characteristic>>

As shown in FIG. 51, the anisotropic conductive connector 10 waspositioned and disposed on a circuit board 5 for an inspection byinserting guide pins 9 of the circuit board 5 for an inspection into thepositioning holes of the supporting body 30 in the anisotropicconductive connector 10.

The circuit device 3 for a test was arranged on the anisotropicconductive connector 10, and these were pressurized at a roomtemperature in a load of 3 kg (a load of approximately 40 g perconducting path forming portion) by means of a pressurizing jig (notshown) and were thus fixed.

Then, a DC current of 10 mA was always applied by a DC power supply 115and a constant current control device 116 between external terminals(not shown) of the circuit board 5 for an inspection, which areelectrically connected to each other through the anisotropic conductiveconnector 10, the circuit device 3 for a test, and the electrode 6 foran inspection and a wiring thereof (not shown) of the circuit board 5for an inspection. In this state, a voltage between the externalterminals of the circuit board 5 for an inspection during thepressurization was measured by means of a voltmeter 110.

An electric resistance value R1 (Ω) was calculated by an equation ofR1=V1/I1, wherein a value (V) of the voltage thus measured isrepresented by V1 and the applied DC current is represented by I1 (=0.01A). A result is shown in Table 1.

 [Table 1]

TABLE 1 Electric resistance value R₁ (mΩ) Example 1 122 Comparativeexample 1 117

As is apparent from the result of the Table 1, it was confirmed that theanisotropic conductive connector A according to the example 1 had anexcellent conductivity which is equivalent to the conductivity of theanisotropic conductive connector B according to the comparative example1 in which the anisotropic conductive film is not provided with thesheet-like connector.

 <<Repetitive Durability>>

As shown in FIG. 51, the anisotropic conductive connector 10 waspositioned and disposed on the circuit board 5 for an inspection byinserting guide pins 9 of the circuit board 5 for an inspection into thepositioning holes of the supporting body 30 in the anisotropicconductive connector 10. In addition, the circuit device 3 for a testwas arranged on the anisotropic conductive connector 10. These werefixed by a pressurizing jig (not shown) and were arranged within athermostatic chamber 7 in this state.

Subsequently, a temperature in the thermostatic chamber 7 was set to be90° C. and the pressurization was repeated in a pressurizing cycle of 5seconds/stroke and a load of 2.5 kg (a load of approximately 35 g perconducting path forming portion) by means of a pressurizing jig. At thesame time, a DC current of 10 mA was always applied by a DC power supply115 and a constant current control device 116 between external terminals(not shown) of the circuit board 5 for an inspection, which areelectrically connected to each other through the anisotropic conductiveconnector 10, the circuit device 3 for a test, and the electrode 6 foran inspection and a wiring thereof (not shown) of the circuit board 5for an inspection. In this state, a voltage between the externalterminals of the circuit board 5 for an inspection during thepressurization was measured by means of a voltmeter 110.

An electric resistance value R1 (Ω) was calculated by an equation ofR1=V1/I1, wherein a value (V) of the voltage thus measured isrepresented by V1 and the applied DC current is represented by. I1(=0.01 A).

The electric resistance value R1 includes an electric resistance valuebetween the electrodes of the circuit device 3 for a test and anelectric resistance value between the external terminals of the circuitboard 5 for an inspection, in addition to the electric resistance valuesof the two conducting path forming portions.

In the case in which the electric resistance value R1 was greater than 1Ω, the measurement was stopped. A result is shown in Table 2.

 [Table 2]

TABLE 2 Electric resistance value R1, (mΩ) 5000 10000 20000 50000 Numberof pressurizations Once times times times times Example 1 112 136 191270 400 Comparative example 1 117 134 170 787 1 Ω or more

After the durability test (a repetitive pressurization at 50000 times)was ended, the surface of the conducting path forming portion of eachanisotropic conductive connector was visually observed.

As a result, referring to the anisotropic conductive connector Aaccording to the example 1, the conducting path forming portion (12) wasrarely deformed and the deformation of the electrode structure (22) ofthe sheet-like connector (20) on the surface was not observed. Althougha small amount of solder was stuck to the surface of the electrodestructure (22), a change in an appearance was rarely observed and it wasconfirmed that the conductive particle was held in the conducting pathforming portion (12).

Referring to the anisotropic conductive connector B according to thecomparative example 1, a dent was formed in the surface layer part ofthe conducting path forming portion and the conductive particle waspresent in the surface layer part of the insulating portion around thedent which is formed.

The reason can be guessed as follows. More specifically, thepressurization is repeated by the protruded electrode so that thesurface layer part of the conducting path forming portion is worn out.As a result, the conductive particle contained in the surface layer partis scattered toward surroundings, and the pressurization is furthercarried out by a circuit device for a test so that the conductiveparticle is pushed into the surface layer part of the insulatingportion. The conductive particle remaining in the conducting pathforming portion was discolored to be gray and the sticking of a soldercomponent was observed.

As is apparent from the above-mentioned result, according to theanisotropic conductive connector A in accordance with the example 1, itwas confirmed that it is possible to suppress a permanent deformationdue to a pressure contact of the protruded electrode and a deformationdue to an abrasion even if the conductive path forming portion isrepetitively pressed by the protruded electrode, and to obtain a stableconductivity for a long period of time.

In the present invention, it is possible to make various changes withouta restriction to the embodiments described above.

(1) It is not essential that the supporting body is provided in theanisotropic conductive connector device 10.

(2) In the case in which the anisotropic conductive connector 10according to the present invention is used in an electrical inspectionfor the circuit device, the anisotropic conductive film may be bondedintegrally with the circuit board for an inspection. According to such astructure, it is possible to reliably prevent a positional shift betweenthe anisotropic conductive film and the circuit board for an inspection.

The anisotropic conductive connector device can be manufactured by usinga metal mold for manufacturing the anisotropic conductive connectordevice which has a circuit board disposing space region capable ofdisposing a board for an inspection in a molding space, disposing thecircuit board for an inspection in the board disposing space region inthe molding space of the metal mold, and injecting a molding material inthe molding space to carry out a curing treatment in this state, forexample.

(3) The anisotropic conductive film may be formed by a laminated productincluding different types of layers from each other. More specifically,it is possible to form a conductive path forming portion having thedegrees of an elasticity and a conductivity controlled by employing,

a structure in which the anisotropic conductive film is constituted by alaminated product having a plurality of layers formed by elasticallypolymeric substances having different hardnesses from each other,

a structure in which the anisotropic conductive film is constituted by alaminated product including a plurality of layers containing differenttypes of conductive particles in a portion to be the conducting pathforming portion respectively,

a structure in which the anisotropic conductive film is constituted by alaminated product including a plurality of layers containing conductiveparticles having different particle diameters in the portion to be theconducting path forming portion respectively, or

a structure in which the anisotropic conductive film is constituted by alaminated product including a plurality of layers having differentcontentrates of the conductive particles in the portion to be theconducting path forming portion respectively.

Such an anisotropic conductive film can be manufactured by a methoddescribed in International Laid-Open Patent Publication WO 03/075408,for example.

(4) In the anisotropic conductive connector device according to thepresent invention, the conducting path forming portions are arranged ata constant pitch irrespective of the pattern of the electrode to beinspected as shown in FIGS. 44 and 45. In addition, parts of theseconducting path forming portions can be set to be effective conductingpath forming portions which are electrically connected to the electrodeto be inspected. Moreover, the other conducting path forming portionscan be set to be ineffective conducting path forming portions which arenot electrically connected to the electrode to be inspected.

According to the anisotropic conductive connector device having such astructure, in the manufacture of the anisotropic conductive connectordevice, the magnetic layers in the metal mold are disposed at a constantpitch. When a magnetic field is applied to the molding material layer,consequently, it is possible to efficiently collect and orient theconductive particles in a predetermined position. Consequently, thedensity of the conductive particles can be uniform in each of theconducting path forming portions which are obtained. Thus, it ispossible to obtain an anisotropic conductive connector device having asmall difference in the resistance value of each conducting path formingportion.

(5) The specific shape and structure of the anisotropic conductive filmcan be changed variously.

For example, the anisotropic conductive film 10A may have, in a centralpart thereof, a concave portion on a surface contacting with theelectrode to be inspected in the circuit device to be an inspectingobject.

Moreover, the anisotropic conductive film 10A may have a through hole inthe central part thereof.

Furthermore, the anisotropic conductive film 10A may have theineffective conducting path forming portion provided in a portionsupported by the supporting body 30.

In addition, the anisotropic conductive film 10A may have the othersurface to be flat.

(6) In the method of manufacturing an anisotropic conductive connectordevice, in the case in which the protective film 62 to be providedbetween the molding surface of the upper mold 50 and the sheet-likeconnector 20 is formed by a resist material, for example, it is alsopossible to manufacture a laminated product obtained by previouslyproviding the protective film 62 formed by the resist material on thesurface of the sheet-like connector 20 and to dispose the laminatedproduct on the molding surface of the upper mold 50.

According to such a method, the protective film 62 can be formed in aclose contact state with the surface of the sheet-like connector 20.Therefore, the molding material can be prevented from entering thesurface of the sheet-like connector 20 still more reliably.

(7) In the method of manufacturing an anisotropic conductive connectordevice, the anisotropic conductive connector and the sheet-likeconnector may be manufactured individually and the anisotropicconductive connector and the sheet-like connector may be then integratedby using an adhesive or the like, thereby manufacturing the anisotropicconductive connector device.

In the sheet-like connector according to the present invention, theinsulating sheet is formed by a mesh or a nonwoven fabric as shown inFIG. 48 or a porous sheet which is not shown. When the sheet-likeconnector is to be fixed to the anisotropic conductive film of theanisotropic conductive connector by using an adhesive or the like,therefore, the adhesive enters the void of the mesh, the nonwoven fabricor the porous sheet so that the sheet-like connector can be bonded andfixed firmly even if a through hole for the adhesive is not formed.Thus, it is possible to make various changes without departing from theobjects of the present invention.

1. An anisotropic conductive connector device comprising: an anisotropicconductive film provided with a plurality of conducting path formingportions extended in a direction of a thickness in a state in which theyare insulated from each other through an insulating portion; and asheet-like connector in which an insulating sheet is provided with aplurality of electrode structures extended in a direction of a thicknessthereof, wherein the sheet-like connector is provided integrally on theanisotropic conductive film in a state in which each of the electrodestructures is positioned on each of the conducting path forming portionsof the anisotropic conductive film, the sheet-like connector is providedwith a through hole penetrating through both sides of the insulatingsheet and the electrode structure is provided in the through hole, theelectrode structure of the sheet-like connector includes a surfaceelectrode portion exposed from a surface of the insulating sheet, a backelectrode portion exposed from a back face of the insulating sheet, anda short circuit portion extended in a direction of a thickness of theinsulating sheet, the surface electrode portion and the back electrodeportion are coupled integrally through the short circuit portion, theinsulating portion of the anisotropic conductive film is provided with aprotruded portion for coupling which is protruded from a surfacethereof, and the protruded portion for coupling in the anisotropicconductive film is inserted in the through hole for coupling in thesheet-like connector.
 2. The anisotropic conductive connector deviceaccording to claim 1, wherein the anisotropic conductive film is formedby an insulating elastically polymeric substance, and the conductingpath forming portion contains a conductive particle exhibiting amagnetism.
 3. The anisotropic conductive connector device according toclaim 1, wherein a supporting body for supporting a peripheral edgeportion of the anisotropic conductive film is provided.
 4. Theanisotropic conductive connector device according to claim 1, which isprovided between a circuit device to be an inspecting object and acircuit board for an inspection and serves to carry out an electricalconnection of an electrode to be inspected in the circuit device and aninspecting electrode of the circuit board, wherein the sheet-likeconnector is disposed on one surface side placed in contact with thecircuit device to be the inspecting object.
 5. The anisotropicconductive connector device according to claim 4, wherein theanisotropic conductive film is provided with the conducting path formingportions which are not electrically connected to the electrode to beinspected, in addition to the conducting path forming portions which iselectrically connected to the electrode to be inspected in the circuitdevice to be the inspecting object.
 6. The anisotropic conductiveconnector device according to claim 4, wherein the conducting pathforming portions are disposed at a constant pitch.
 7. An apparatus forinspecting a circuit device comprising: a circuit board for aninspection which has an electrode for an inspection disposedcorresponding to an electrode to be inspected in a circuit device to bean inspecting object; and the anisotropic conductive connector deviceaccording to claim 1 which is disposed on the circuit board for aninspection.
 8. An anisotropic conductive connector device comprising: ananisotropic conductive film provided with a plurality of conducting pathforming portions extended in a direction of a thickness in a state inwhich they are insulated from each other through an insulating portion;and a sheet-like connector in which an insulating sheet is provided witha plurality of electrode structures extended in a direction of athickness thereof, wherein the sheet-like connector is integrated on theanisotropic conductive film in a state in which each of the electrodestructures is positioned on each of the conducting path forming portionsof the anisotropic conductive film, and the sheet-like connector isprovided with a void communicating with both sides of the insulatingsheet and the electrode structure is provided in the void.
 9. Theanisotropic conductive connector device according to claim 8, whereinthe insulating sheet of the sheet-like connector is formed by a mesh, anonwoven fabric or a porous sheet.